Part Details for GS1662-IBE3 by Semtech Corporation
Results Overview of GS1662-IBE3 by Semtech Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for GS1662-IBE3
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
06X0107
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Newark | Sd/Hd Sdi Transmitter - No Audio |Semtech GS1662-IBE3 RoHS: Not Compliant Min Qty: 168 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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Part Details for GS1662-IBE3
GS1662-IBE3 CAD Models
GS1662-IBE3 Part Data Attributes
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GS1662-IBE3
Semtech Corporation
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Datasheet
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GS1662-IBE3
Semtech Corporation
Consumer Circuit, PBGA100, 11 X 11 MM, 1.71 MM HEIGHT, 1 MM PITCH, GREEN, PLASTIC, MO-192, LBGA-100
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SEMTECH CORP | |
Package Description | LBGA, BGA100,10X10,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | SEMTECH | |
Additional Feature | ALSO OPERATES AT 3.13 TO 3.47 V ANALOG SUPPLY; SEATED HGT-NOM | |
Consumer IC Type | CONSUMER CIRCUIT | |
JESD-30 Code | S-PBGA-B100 | |
JESD-609 Code | e1 | |
Length | 11 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 100 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -20 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA100,10X10,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.7 mm | |
Supply Current-Max | 150 mA | |
Supply Voltage-Max (Vsup) | 1.26 V | |
Supply Voltage-Min (Vsup) | 1.14 V | |
Surface Mount | YES | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 11 mm |
GS1662-IBE3 Frequently Asked Questions (FAQ)
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The recommended PCB layout for the GS1662-IBE3 involves placing the device near the antenna, using a solid ground plane, and minimizing the length of the transmission lines. A 4-layer PCB with a dedicated ground plane is recommended.
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To optimize the antenna design, use a 50-ohm antenna with a quarter-wavelength monopole or a half-wavelength dipole. The antenna should be matched to the device's output impedance, and the antenna's radiation pattern should be considered to ensure optimal performance.
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The maximum transmit power of the GS1662-IBE3 is +20 dBm (100 mW). However, the actual transmit power may vary depending on the application and regulatory requirements.
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Frequency hopping can be implemented using the device's built-in frequency synthesizer and a microcontroller to control the frequency switching. The GS1662-IBE3 supports up to 16 frequency channels, and the frequency switching time is typically around 100 μs.
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The latency of the GS1662-IBE3 is typically around 2-3 ms, depending on the modulation scheme and data rate. The device supports fast frequency switching, which enables low-latency transmission.