Memory
GS81302D36E-375
GSI Technology
Description: DDR SRAM, 4MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165

Overview of GS81302D36E-375 by GSI Technology

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Price & Stock for GS81302D36E-375 by GSI Technology

Part # Manufacturer Description Stock Price Buy
DISTI # GS81302D36E-375
Avnet Americas SRAM Chip Sync Dual 1.8V 144M-Bit 4M x 36 0.45ns 165-Pin FBGA Tray - Bulk (Alt: GS81302D36E-375) RoHS: Not Compliant Min Qty: 105 Package Multiple: 105 Lead time: 24 Weeks, 0 Days Container: Bulk 0
  • 105 $207.9000
  • 210 $204.1200
  • 420 $194.0400
  • 630 $189.0000
  • 840 $182.7000
  • 1,050 $173.8800
  • 10,500 $168.8400
$168.8400 / $207.9000 Buy Now
DISTI # 464-GS81302D36E-375
Mouser Electronics SRAM RoHS: Not Compliant 0
  • 10 $187.9600
$187.9600 Order Now

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Part Data Attributes for GS81302D36E-375 by GSI Technology

GS81302D36E-375
GSI Technology
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Not Recommended
Ihs Manufacturer
GSI TECHNOLOGY
Part Package Code
BGA
Package Description
LBGA,
Pin Count
165
Reach Compliance Code
compliant
ECCN Code
3A991.B.2.B
HTS Code
8542.32.00.41
Factory Lead Time
24 Weeks
Access Time-Max
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B165
Length
17 mm
Memory Density
150994944 bit
Memory IC Type
DDR SRAM
Memory Width
36
Number of Functions
1
Number of Terminals
165
Number of Words
4194304 words
Number of Words Code
4000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
4MX36
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
1.5 mm
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15 mm
Want to compare parts?
  1. GS81302D36E-375
    GSI Technology
    DDR SRAM, 4MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165
    VS

Alternate Parts for GS81302D36E-375

This table gives cross-reference parts and alternative options found for GS81302D36E-375. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS81302D36E-375, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
GS81302D36GE-375 DDR SRAM, 4MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS81302D36E-375 vs GS81302D36GE-375
Part Number Description Manufacturer Compare
GS81302D36GE-375 DDR SRAM, 4MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS81302D36E-375 vs GS81302D36GE-375

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