Part Details for H5AN4G6NBJR-UHC by SK Hynix Inc
Results Overview of H5AN4G6NBJR-UHC by SK Hynix Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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H5AN4G6NBJR-UHC Information
H5AN4G6NBJR-UHC by SK Hynix Inc is a DRAM.
DRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for H5AN4G6NBJR-UHC
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
HY57V641620FTP-H-C
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Avnet Silica | DRAM Chip DDR4 SDRAM 4GBit 256M X 16 12V 96Pin FPBGA (Alt: HY57V641620FTP-H-C) RoHS: Compliant Min Qty: 960 Package Multiple: 960 Lead time: 17 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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LCSC | 4Gbit SDRAM DDR4 FBGA-96 DDR SDRAM ROHS | 366 |
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$1.4597 / $2.5810 | Buy Now |
|
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Vyrian | Memory ICs | 791 |
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RFQ |
Part Details for H5AN4G6NBJR-UHC
H5AN4G6NBJR-UHC CAD Models
H5AN4G6NBJR-UHC Part Data Attributes
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H5AN4G6NBJR-UHC
SK Hynix Inc
Buy Now
Datasheet
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H5AN4G6NBJR-UHC
SK Hynix Inc
DDR DRAM, 256MX16, CMOS, PBGA96, FBGA-96
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SK HYNIX INC | |
| Package Description | FBGA-96 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH | |
| JESD-30 Code | R-PBGA-B96 | |
| Length | 13 mm | |
| Memory Density | 4294967296 bit | |
| Memory IC Type | DDR4 DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 268435456 words | |
| Number of Words Code | 256000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 256MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.26 V | |
| Supply Voltage-Min (Vsup) | 1.14 V | |
| Supply Voltage-Nom (Vsup) | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 7.5 mm |