There are no models available for this part yet.
Overview of HCC40174BDG by STMicroelectronics
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Aerospace and Defense
Energy and Power Systems
Healthcare
CAD Models for HCC40174BDG by STMicroelectronics
Part Data Attributes for HCC40174BDG by STMicroelectronics
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Part Life Cycle Code
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Active
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Ihs Manufacturer
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STMICROELECTRONICS
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Package Description
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,
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Manufacturer Package Code
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DIL16 FP
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Reach Compliance Code
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compliant
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ECCN Code
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EAR99
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HTS Code
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8542.39.00.01
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Samacsys Manufacturer
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STMicroelectronics
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Family
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4000/14000/40000
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JESD-30 Code
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R-GDIP-T16
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Length
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20.32 mm
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Logic IC Type
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D FLIP-FLOP
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Number of Bits
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6
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Number of Functions
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1
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Number of Terminals
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16
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Operating Temperature-Max
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125 °C
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Operating Temperature-Min
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-55 °C
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Package Body Material
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CERAMIC, GLASS-SEALED
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Package Code
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DIP
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Package Equivalence Code
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DIP16,.3
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE
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Seated Height-Max
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3.83 mm
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Supply Voltage-Max (Vsup)
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20 V
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Supply Voltage-Min (Vsup)
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3 V
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Surface Mount
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NO
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Technology
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CMOS
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Terminal Form
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THROUGH-HOLE
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Terminal Pitch
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2.54 mm
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Terminal Position
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DUAL
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Total Dose
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100k Rad(Si) V
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Width
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7.62 mm
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