Part Details for HCPL-9000 by Agilent Technologies Inc
Overview of HCPL-9000 by Agilent Technologies Inc
- Distributor Offerings: (0 listings)
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
ADE9000ACPZ-RL | Analog Devices | , Power Quality Monitoring AFE | |
EVAL-ADE9000EBZ | Analog Devices | ADE9000 evaluation board | |
ADE9000ACPZ | Analog Devices | MC, Power Quality Monitoring A |
Part Details for HCPL-9000
HCPL-9000 CAD Models
HCPL-9000 Part Data Attributes
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HCPL-9000
Agilent Technologies Inc
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Datasheet
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HCPL-9000
Agilent Technologies Inc
Logic Circuit, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | AGILENT TECHNOLOGIES INC | |
Part Package Code | DIP | |
Package Description | DIP, | |
Pin Count | 8 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
Family | 9000 | |
JESD-30 Code | R-PDIP-T8 | |
JESD-609 Code | e0 | |
Length | 9.779 mm | |
Logic IC Type | LOGIC CIRCUIT | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 4.699 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm |