There are no models available for this part yet.
Overview of HD64F2633F25 by Hitachi Ltd
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
CAD Models for HD64F2633F25 by Hitachi Ltd
Part Data Attributes for HD64F2633F25 by Hitachi Ltd
|
|
---|---|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
HITACHI LTD
|
Package Description
|
QFP, QFP128,.63X.87,20
|
Reach Compliance Code
|
unknown
|
HTS Code
|
8542.31.00.01
|
Bit Size
|
16
|
CPU Family
|
H8S/2600
|
JESD-30 Code
|
R-PQFP-G128
|
Number of Terminals
|
128
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
-20 °C
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
QFP
|
Package Equivalence Code
|
QFP128,.63X.87,20
|
Package Shape
|
RECTANGULAR
|
Package Style
|
FLATPACK
|
Qualification Status
|
Not Qualified
|
RAM (bytes)
|
16384
|
ROM (words)
|
262144
|
ROM Programmability
|
FLASH
|
Speed
|
25 MHz
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
0.5 mm
|
Terminal Position
|
QUAD
|
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