Datasheets
HI1-201HS-2 by:

QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP16

Part Details for HI1-201HS-2 by Intersil Corporation

Results Overview of HI1-201HS-2 by Intersil Corporation

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HI1-201HS-2 Information

HI1-201HS-2 by Intersil Corporation is a Multiplexer or Switch.
Multiplexers or Switches are under the broader part category of Signal Circuits.

A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.

Available Datasheets

Part # Manufacturer Description Datasheet
HI1-0509-7 Rochester Electronics LLC HI1-0509 - Differential Multiplexer, 1 Func, 4 Channel, CMOS, CDIP16
HI1-0509A/B Rochester Electronics LLC HI1-0509 - Differential Multiplexer, 1 Func, 4 Channel, CMOS, CDIP16
HS9-201HSRH-8 Renesas Electronics Corporation Radiation Hardened High Speed, Quad SPST, CMOS Analog Switch

Part Details for HI1-201HS-2

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HI1-201HS-2 Part Data Attributes

HI1-201HS-2 Intersil Corporation
Buy Now Datasheet
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HI1-201HS-2 Intersil Corporation QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP16
Part Life Cycle Code Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR
Package Description ,
Reach Compliance Code unknown
HTS Code 8542.39.00.01
Analog IC - Other Type SPST
JESD-30 Code R-GDIP-T16
Neg Supply Voltage-Nom (Vsup) -15 V
Number of Channels 1
Number of Functions 4
Number of Terminals 16
Off-state Isolation-Nom 72 dB
On-state Resistance Match-Nom 3 Ω
On-state Resistance-Max (Ron) 50 Ω
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Qualification Status Not Qualified
Supply Voltage-Nom (Vsup) 15 V
Surface Mount NO
Switch-off Time-Max 50 ns
Switch-on Time-Max 50 ns
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for HI1-201HS-2

This table gives cross-reference parts and alternative options found for HI1-201HS-2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HI1-201HS-2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
HI1-201HS-4 Harris Semiconductor Check for Price SPST, 4 Func, 1 Channel, CMOS, CDIP16, HI1-201HS-2 vs HI1-201HS-4
Part Number Manufacturer Composite Price Description Compare
HI1-201HS-2 Harris Semiconductor Check for Price SPST, 4 Func, 1 Channel, CMOS, CDIP16, HI1-201HS-2 vs HI1-201HS-2
HI1-201HS/883 Intersil Corporation Check for Price QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP16 HI1-201HS-2 vs HI1-201HS/883
HI1-201HS/883 Harris Semiconductor Check for Price SPST, 4 Func, 1 Channel, CMOS, CDIP16, HI1-201HS-2 vs HI1-201HS/883

HI1-201HS-2 Related Parts

HI1-201HS-2 Frequently Asked Questions (FAQ)

  • The recommended operating temperature range for the HI1-201HS-2 is -40°C to 125°C.

  • To ensure reliable operation in high-frequency applications, it's essential to follow proper PCB layout and design guidelines, including minimizing lead lengths, using appropriate decoupling capacitors, and ensuring good power supply bypassing.

  • The maximum allowable power dissipation for the HI1-201HS-2 is 500 mW. Exceeding this limit can lead to device failure or reduced lifespan.

  • Yes, the HI1-201HS-2 can be used in switching regulator applications, but it's essential to ensure that the device is properly bypassed and that the switching frequency is within the recommended range to avoid oscillations and instability.

  • To handle ESD protection, it's recommended to follow standard ESD handling procedures, including using ESD-safe workstations, wrist straps, and packaging materials. Additionally, ensure that the device is properly grounded during handling and assembly.

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