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Flash, 4GX8, PBGA153, FBGA-153
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
IS21ES04G-JCLI by Integrated Silicon Solution Inc is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
IS21ES04G-JCLI
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Avnet Silica | Flash Card 4Gbyte 33V Embedded MMC 153Pin VFBGA (Alt: IS21ES04G-JCLI) RoHS: Compliant Min Qty: 152 Package Multiple: 152 | Silica - 0 |
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Buy Now | |
DISTI #
IS21ES04G-JCLI
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EBV Elektronik | Flash Card 4Gbyte 33V Embedded MMC 153Pin VFBGA (Alt: IS21ES04G-JCLI) RoHS: Compliant Min Qty: 152 Package Multiple: 152 Lead time: 53 Weeks, 0 Days | EBV - 0 |
|
Buy Now | |
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Win Source Electronics | IC FLASH 32GBIT EMMC 153VFBGA | 2000 |
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$120.7143 / $139.2857 | Buy Now |
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IS21ES04G-JCLI
Integrated Silicon Solution Inc
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Datasheet
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IS21ES04G-JCLI
Integrated Silicon Solution Inc
Flash, 4GX8, PBGA153, FBGA-153
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Rohs Code | Yes | |
Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Date Of Intro | 2016-09-13 | |
Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
JESD-30 Code | R-PBGA-B153 | |
JESD-609 Code | e1 | |
Length | 13 mm | |
Memory Density | 34359738368 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 153 | |
Number of Words | 4294967296 words | |
Number of Words Code | 4000000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 4GX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Programming Voltage | 3.3 V | |
Seated Height-Max | 1 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 10 | |
Width | 11.5 mm |