Part Details for IS43LQ32256B-053BLI by Integrated Silicon Solution Inc
Overview of IS43LQ32256B-053BLI by Integrated Silicon Solution Inc
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for IS43LQ32256B-053BLI
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
70AK7861
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Newark | 8G, 1.06-1.17/1.70-1.95V, Lpddr4, 256Mx32, 1866Mhz, 200 Ball Bga (10Mm X 14.5Mm) Rohs |Integrated Silicon Solution (Issi) IS43LQ32256B-053BLI RoHS: Not Compliant Min Qty: 136 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$16.9400 / $17.4300 | Buy Now |
|
DISTI #
706-IS43LQ32256B-053BLI-ND
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DigiKey | IC DRAM 8GBIT LVSTL 200VFBGA Min Qty: 1 Lead time: 12 Weeks Container: Tray |
100 In Stock |
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$12.8750 / $23.5800 | Buy Now |
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DISTI #
IS43LQ32256B-053BL
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Avnet Americas | DRAM Chip Mobile LPDDR4 SDRAM 8 GB 256M x 32 1.8V 200-Pin TFBGA - Trays (Alt: IS43LQ32256B-053BL) RoHS: Not Compliant Min Qty: 136 Package Multiple: 136 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$14.6537 | Buy Now |
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DISTI #
870-43LQ32256B053BLI
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Mouser Electronics | DRAM 8G, 1.06-1.17/1.70-1.95V, LPDDR4, 256Mx32, 1866MHz, 200 ball BGA (10mmx14.5mm) RoHS RoHS: Compliant | 0 |
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$15.5500 / $15.5700 | Order Now |
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DISTI #
IS43LQ32256B-053BLI
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Avnet Asia | DRAM Chip Mobile LPDDR4 SDRAM 8 GB 256M x 32 1.8V 200-Pin TFBGA (Alt: IS43LQ32256B-053BLI) RoHS: Compliant Min Qty: 136 Package Multiple: 136 Lead time: 12 Weeks, 0 Days | 0 |
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RFQ | |
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DISTI #
IS43LQ32256B-053BLI
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Avnet Silica | DRAM Chip Mobile LPDDR4 SDRAM 8 GB 256M x 32 1.8V 200-Pin TFBGA (Alt: IS43LQ32256B-053BLI) RoHS: Compliant Min Qty: 136 Package Multiple: 136 Lead time: 28 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for IS43LQ32256B-053BLI
IS43LQ32256B-053BLI CAD Models
IS43LQ32256B-053BLI Part Data Attributes
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IS43LQ32256B-053BLI
Integrated Silicon Solution Inc
Buy Now
Datasheet
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Compare Parts:
IS43LQ32256B-053BLI
Integrated Silicon Solution Inc
LPDDR4 DRAM, 256MX32, CMOS, PBGA200, FBGA-200
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | FBGA-200 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Factory Lead Time | 12 Weeks | |
| Access Mode | MULTI BANK PAGE BURST | |
| Clock Frequency-Max (fCLK) | 1866 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 16,32 | |
| JESD-30 Code | R-PBGA-B200 | |
| Length | 14.5 mm | |
| Memory Density | 8589934592 bit | |
| Memory IC Type | LPDDR4 DRAM | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 200 | |
| Number of Words | 268435456 words | |
| Number of Words Code | 256000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256MX32 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA200,12X22,32/25 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.1 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 16,32 | |
| Standby Current-Max | 0.014 A | |
| Supply Current-Max | 0.46 mA | |
| Supply Voltage-Max (Vsup) | 1.17 V | |
| Supply Voltage-Min (Vsup) | 1.06 V | |
| Supply Voltage-Nom (Vsup) | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 10 mm |