Part Details for IS46TR16512B-107MBLA1 by Integrated Silicon Solution Inc
Overview of IS46TR16512B-107MBLA1 by Integrated Silicon Solution Inc
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for IS46TR16512B-107MBLA1
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
74AC6593
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Newark | Automotive (Tc: -40 To +95C), 8G, 1.5V, Ddr3, 512Mx16, 1866Mt/S @ 13-13-13, 96 Ball Bga (10Mm X 14Mm) Rohs |Integrated Silicon Solution (Issi) IS46TR16512B-107MBLA1 RoHS: Not Compliant Min Qty: 136 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$22.1200 / $22.7700 | Buy Now |
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DISTI #
706-IS46TR16512B-107MBLA1-ND
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DigiKey | IC DRAM 8GBIT PARALLEL 96TWBGA Min Qty: 136 Lead time: 10 Weeks Container: Bulk | Temporarily Out of Stock |
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$23.2585 | Buy Now |
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DISTI #
IS46TR16512B-107MB
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Avnet Americas | Automotive (Tc: -40 to +95C), 8G, 1.5V, DDR3, 512Mx16, 1866MT/s @ 13-13-13, 96 ball BGA (10mm x 14mm) RoHS - Trays (Alt: IS46TR16512B-107MB) RoHS: Compliant Min Qty: 136 Package Multiple: 136 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$21.8347 | Buy Now |
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DISTI #
870-46TR16512B107MB1
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Mouser Electronics | DRAM Automotive (Tc: -40 to +95C), 8G, 1.5V, DDR3, 512Mx16, 1866MT/s a. 13-13-13, 96 ball BGA (10mm x 14mm) RoHS RoHS: Compliant | 0 |
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$22.0800 / $22.5100 | Order Now |
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DISTI #
IS46TR16512B-107MBLA1
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Avnet Silica | (Alt: IS46TR16512B-107MBLA1) RoHS: Compliant Min Qty: 136 Package Multiple: 136 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for IS46TR16512B-107MBLA1
IS46TR16512B-107MBLA1 CAD Models
IS46TR16512B-107MBLA1 Part Data Attributes
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IS46TR16512B-107MBLA1
Integrated Silicon Solution Inc
Buy Now
Datasheet
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Compare Parts:
IS46TR16512B-107MBLA1
Integrated Silicon Solution Inc
DRAM,
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | TFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Factory Lead Time | 12 Weeks | |
| Date Of Intro | 2017-09-18 | |
| Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH | |
| JESD-30 Code | R-PBGA-B96 | |
| JESD-609 Code | e1 | |
| Length | 14 mm | |
| Memory Density | 8589934592 bit | |
| Memory IC Type | DDR3 DRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 536870912 words | |
| Number of Words Code | 512000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.575 V | |
| Supply Voltage-Min (Vsup) | 1.425 V | |
| Supply Voltage-Nom (Vsup) | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Width | 10 mm |