Datasheets
K4B2G0846D-HYK0 by:

DDR DRAM, 256MX8, 0.225ns, CMOS, PBGA78

Part Details for K4B2G0846D-HYK0 by Samsung Semiconductor

Overview of K4B2G0846D-HYK0 by Samsung Semiconductor

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Applications Consumer Electronics Education and Research Computing and Data Storage

Price & Stock for K4B2G0846D-HYK0

Part # Distributor Description Stock Price Buy
Quest Components   25
  • 1 $12.0000
  • 5 $9.0000
$9.0000 / $12.0000 Buy Now

Part Details for K4B2G0846D-HYK0

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K4B2G0846D-HYK0 Part Data Attributes

K4B2G0846D-HYK0 Samsung Semiconductor
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K4B2G0846D-HYK0 Samsung Semiconductor DDR DRAM, 256MX8, 0.225ns, CMOS, PBGA78
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.36
Access Time-Max 0.225 ns
Clock Frequency-Max (fCLK) 800 MHz
I/O Type COMMON
Interleaved Burst Length 8
JESD-30 Code R-PBGA-B78
Memory Density 2147483648 bit
Memory IC Type DDR3L DRAM
Memory Width 8
Number of Terminals 78
Number of Words 268435456 words
Number of Words Code 256000000
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 256MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA78,9X13,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, FINE PITCH
Qualification Status Not Qualified
Refresh Cycles 8192
Sequential Burst Length 8
Standby Current-Max 0.01 A
Supply Current-Max 0.125 mA
Supply Voltage-Nom (Vsup) 1.35 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM

Alternate Parts for K4B2G0846D-HYK0

This table gives cross-reference parts and alternative options found for K4B2G0846D-HYK0. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4B2G0846D-HYK0, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
H5TQ2G83FFR-G7J DDR DRAM, 256MX8, 0.3ns, CMOS, PBGA78, FBGA-78 SK Hynix Inc K4B2G0846D-HYK0 vs H5TQ2G83FFR-G7J
NT5CC256M8BN-AC DDR DRAM, 256MX8, 0.4ns, CMOS, PBGA78, 0.80 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, WBGA-78 Nanya Technology Corporation K4B2G0846D-HYK0 vs NT5CC256M8BN-AC
H5TQ2G83DFR-PBC DDR DRAM, 256MX8, 0.225ns, CMOS, PBGA78, HALOGEN FREE AND ROHS COMPLIANT, FBGA-78 SK Hynix Inc K4B2G0846D-HYK0 vs H5TQ2G83DFR-PBC
MT41K256M8HX-15E:D DDR DRAM, 256MX8, CMOS, PBGA78, 9 X 11.50 MM, LEAD FREE, FBGA-78 Micron Technology Inc K4B2G0846D-HYK0 vs MT41K256M8HX-15E:D
IS43TR82560A-15HBLI DDR DRAM, 256MX8, 13.125ns, CMOS, PBGA78, 9 X 10.50 MM, 0.80 MM PITCH, LEAD FREE, FBGA-78 Integrated Silicon Solution Inc K4B2G0846D-HYK0 vs IS43TR82560A-15HBLI
H5TQ2G83FFR-G7C DDR DRAM, 256MX8, 0.3ns, CMOS, PBGA78, FBGA-78 SK Hynix Inc K4B2G0846D-HYK0 vs H5TQ2G83FFR-G7C
MT41J256M8HX-125AIT:D DDR DRAM, 256MX8, CMOS, PBGA78, 9 X 11.50 MM, LEAD FREE, FBGA-78 Micron Technology Inc K4B2G0846D-HYK0 vs MT41J256M8HX-125AIT:D
H5TQ2G83EFR-RDC DDR DRAM, 256MX8, 0.195ns, CMOS, PBGA78, HALOGEN FREE AND ROHS COMPLIANT, FBGA-78 SK Hynix Inc K4B2G0846D-HYK0 vs H5TQ2G83EFR-RDC
IS46TR82560A-187FBLA1 DDR DRAM, 256MX8, 13.125ns, CMOS, PBGA78, 9 X 10.50 MM, 0.80 MM PITCH, LEAD FREE, FBGA-78 Integrated Silicon Solution Inc K4B2G0846D-HYK0 vs IS46TR82560A-187FBLA1
IS43TR82560A-125KBLI DDR DRAM, 256MX8, 13.125ns, CMOS, PBGA78, 9 X 10.50 MM, 0.80 MM PITCH, LEAD FREE, FBGA-78 Integrated Silicon Solution Inc K4B2G0846D-HYK0 vs IS43TR82560A-125KBLI

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