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Part Details for KLM8G1GETF-B0410 by Samsung Semiconductor
Overview of KLM8G1GETF-B0410 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| G881B04102KEU | Amphenol Communications Solutions | Micro Power 3.0 Connector System - G881 Series, Wire to Board connector, , Vertical, Single row, 3.0mm pitch, 04 positions , 100u\\ Tin, 3.18mm tail length, LCP, Black, TRAY | |
| G88MPB04103CEU | Amphenol Communications Solutions | Micro Power Plus, Vertical, Single row, 3.0mm pitch, 04 positions, 100u\\ Tin, 3.18mm tail length, LCP, Black, TRAY |
Part Details for KLM8G1GETF-B0410
KLM8G1GETF-B0410 CAD Models
KLM8G1GETF-B0410 Part Data Attributes
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KLM8G1GETF-B0410
Samsung Semiconductor
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KLM8G1GETF-B0410
Samsung Semiconductor
Flash, 8GX8, PBGA153, FBGA-153
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Package Description | FBGA-153 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | SAMSUNG | |
| Additional Feature | ALSO OPERATES @ 3V SUP NOM | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| JESD-30 Code | R-PBGA-B153 | |
| Length | 13 mm | |
| Memory Density | 68719476736 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 153 | |
| Number of Words | 8589934592 words | |
| Number of Words Code | 8000000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Organization | 8GX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA153,14X14,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 1.8 V | |
| Seated Height-Max | 0.8 mm | |
| Standby Current-Max | 0.000085 A | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Type | MLC NAND TYPE | |
| Width | 11.5 mm |