Datasheets
LAN9500AI-ABZJ-TR by:

4 CHANNEL(S), 480M bps, LOCAL AREA NETWORK CONTROLLER, QCC56, 8 X 8 MM, ROHS COMPLIANT, QFN-56

Part Details for LAN9500AI-ABZJ-TR by Microchip Technology Inc

Results Overview of LAN9500AI-ABZJ-TR by Microchip Technology Inc

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LAN9500AI-ABZJ-TR Information

LAN9500AI-ABZJ-TR by Microchip Technology Inc is a Serial IO/Communication Controller.
Serial IO/Communication Controllers are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for LAN9500AI-ABZJ-TR

Part # Distributor Description Stock Price Buy
DISTI # 41AH8418
Newark Usb-Ethernet Bridge, -40 To 85Deg C, Bridge Type:Usb To 10/100 Ethernet, Supply Voltage Min:3V, Supply Voltage Max:3.6V, Ic Case/Package:Qfn-Ep, No. Of Pins:56Pins, Operating Temperature Min:-40°C, Operating Temperature Max:85°C Rohs Compliant: Yes |Microchip LAN9500AI-ABZJ-TR RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Cut Tape 2653
  • 1 $4.7100
  • 25 $4.7100
  • 50 $4.7100
  • 100 $4.7100
  • 250 $4.7100
  • 500 $4.7100
  • 1,000 $4.7100
$4.7100 Buy Now
DISTI # 69W9519
Newark Hi-Speed Usb 2.0 To 10/100 Ethernet Ctrl 56 Vqfn 8X8X0.9Mm T/R Rohs Compliant: Yes |Microchip LAN9500AI-ABZJ-TR RoHS: Compliant Min Qty: 3000 Package Multiple: 1 Date Code: 0 Container: Reel 0
  • 3,000 $5.2800
$5.2800 Buy Now
DISTI # LAN9500AI-ABZJ-TR
Microchip Technology Inc Hi-Speed USB 2.0 to 10/100 Ethernet Controller, VQFN, Projected EOL: 2039-11-03 RoHS: Compliant Lead time: 6 Weeks, 0 Days Container: Reel 180000

COO: Singapore, Taiwan
  • 1 $6.5700
  • 25 $5.4700
  • 100 $4.9800
  • 1,000 $4.6000
  • 5,000 $4.3600
$4.3600 / $6.5700 Buy Now
NAC Hi-Speed USB 2.0 to 10/100 Ethernet Ctrl - Package: 56 VQFN 8x8x0.9mm T/R RoHS: Compliant Min Qty: 1 Package Multiple: 3000 156000
  • 1 $6.2200
  • 100 $5.6400
  • 500 $5.2900
  • 1,000 $5.1600
$5.1600 / $6.2200 Buy Now
DISTI # LAN9500AI-ABZJ-TR
Avnet Silica USB 2.0 to 10/100 Ethernet Controller 56-Pin QFN EP T/R (Alt: LAN9500AI-ABZJ-TR) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 6 Weeks, 0 Days Silica - 0
Buy Now
Chip-Germany GmbH   RoHS: Not Compliant 2848
RFQ
DISTI # LAN9500AI-ABZJ-TR
EBV Elektronik USB 2.0 to 10/100 Ethernet Controller 56-Pin QFN EP T/R (Alt: LAN9500AI-ABZJ-TR) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 5 Weeks, 0 Days EBV - 6000
Buy Now
LCSC QFN-56-EP(8x8) Ethernet Controllers ROHS 204
  • 1 $5.0809
  • 10 $4.3435
  • 30 $3.9044
  • 100 $3.4608
  • 500 $3.2573
  • 1,000 $3.1639
$3.1639 / $5.0809 Buy Now
New Advantage Corporation   RoHS: Compliant Min Qty: 1 Package Multiple: 3000 6000
  • 3,000 $9.0200
  • 6,000 $8.3400
$8.3400 / $9.0200 Buy Now
Win Source Electronics Ethernet CTLR Single Chip 10Mbps/100Mbps 3.3V 56-Pin VQFN EP T/R / IC USB 2.0-10/100 ETH CRTL 56QFN 17400
  • 17 $3.0563
  • 35 $2.8592
  • 55 $2.7606
  • 79 $2.5634
  • 102 $2.4648
  • 127 $2.3662
$2.3662 / $3.0563 Buy Now

Part Details for LAN9500AI-ABZJ-TR

LAN9500AI-ABZJ-TR CAD Models

LAN9500AI-ABZJ-TR Part Data Attributes

LAN9500AI-ABZJ-TR Microchip Technology Inc
Buy Now Datasheet
Compare Parts:
LAN9500AI-ABZJ-TR Microchip Technology Inc 4 CHANNEL(S), 480M bps, LOCAL AREA NETWORK CONTROLLER, QCC56, 8 X 8 MM, ROHS COMPLIANT, QFN-56
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Part Package Code QFN
Package Description QFN-56
Pin Count 56
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 6 Weeks
Samacsys Manufacturer Microchip
Boundary Scan YES
Bus Compatibility USB
Clock Frequency-Max 25 MHz
Communication Protocol SYNC; BIT ;BYTE
Data Encoding/Decoding Method NRZI; BIPH-LEVEL(MANCHESTER)
Data Transfer Rate-Max 60 MBps
JESD-30 Code S-XQCC-N56
JESD-609 Code e3
Length 8 mm
Low Power Mode YES
Number of Serial I/Os 4
Number of Terminals 56
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Code HVQCCN
Package Equivalence Code LCC56,.31SQ,20
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Seated Height-Max 1 mm
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Terminal Finish Matte Tin (Sn)
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Width 8 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

LAN9500AI-ABZJ-TR Related Parts

LAN9500AI-ABZJ-TR Frequently Asked Questions (FAQ)

  • Microchip provides a recommended PCB layout guide in the LAN9500AI-ABZJ-TR datasheet, but it's also recommended to follow the IEEE 802.3u standard for 100BASE-TX and 10BASE-T Ethernet applications. Additionally, it's essential to minimize the distance between the LAN9500AI-ABZJ-TR and the RJ-45 connector to reduce EMI and improve signal integrity.

  • The LAN9500AI-ABZJ-TR can be configured for half-duplex or full-duplex operation through the MDIX and MDC registers. For half-duplex operation, set MDIX = 0 and MDC = 0. For full-duplex operation, set MDIX = 1 and MDC = 1. Refer to the LAN9500AI-ABZJ-TR datasheet for more information on register settings.

  • The LAN9500AI-ABZJ-TR supports cable lengths up to 100 meters for 100BASE-TX and 10BASE-T Ethernet applications, as specified in the IEEE 802.3u standard.

  • The LAN9500AI-ABZJ-TR has a built-in power management feature that can be controlled through the PME (Power Management Event) pin. The PME pin can be used to detect link status and adjust power consumption accordingly. Additionally, the LAN9500AI-ABZJ-TR has a low-power mode that can be enabled through the LPM (Low Power Mode) register.

  • The LAN9500AI-ABZJ-TR has a maximum junction temperature of 150°C. It's essential to ensure proper thermal design and heat dissipation to prevent overheating. A thermal pad is recommended to improve heat dissipation, and the device should be mounted on a multi-layer PCB with a thermal via to the ground plane.

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