| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
55AJ0387
|
Newark | Lattice Machxo , 2280 Luts, 1.8/2.5/3.3V Rohs Compliant: Yes |Lattice Semiconductor LCMXO2280C-4FTN324C RoHS: Compliant Min Qty: 84 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$40.4000 / $42.4800 | Buy Now | |
|
DISTI #
220-1067-ND
|
DigiKey | IC FPGA 271 I/O 324FTBGA Min Qty: 84 Lead time: 20 Weeks Container: Tray | Temporarily Out of Stock |
|
$40.1000 | Buy Now | |
|
DISTI #
842-MXO2280C4FTN324C
|
Mouser Electronics | FPGA - Field Programmable Gate Array 2280 LUTs 271 IO 1.8 /2.5/3.3V -4 Spd RoHS: Compliant | 84 |
|
$38.6100 / $45.8900 | Buy Now | |
| Flip Electronics | Stock | 673 |
|
RFQ |
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
LATTICE SEMICONDUCTOR CORP
|
|
Part Package Code
|
BGA
|
|
Package Description
|
FTBGA-324
|
|
Pin Count
|
324
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.D
|
|
HTS Code
|
8542.39.00.01
|
|
Samacsys Manufacturer
|
Lattice Semiconductor
|
|
Clock Frequency-Max
|
153.8 MHz
|
|
Combinatorial Delay of a CLB-Max
|
4.4 ns
|
|
JESD-30 Code
|
S-PBGA-B324
|
|
JESD-609 Code
|
e1
|
|
Length
|
19 mm
|
|
Moisture Sensitivity Level
|
3
|
|
Number of CLBs
|
285
|
|
Number of Inputs
|
271
|
|
Number of Logic Cells
|
2280
|
|
Number of Outputs
|
271
|
|
Number of Terminals
|
324
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
285 CLBS
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LBGA
|
|
Package Equivalence Code
|
BGA324,18X18,40
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Programmable Logic Type
|
FIELD PROGRAMMABLE GATE ARRAY
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.7 mm
|
|
Supply Voltage-Max
|
3.465 V
|
|
Supply Voltage-Min
|
1.71 V
|
|
Supply Voltage-Nom
|
1.8 V
|
|
Surface Mount
|
YES
|
|
Temperature Grade
|
OTHER
|
|
Terminal Finish
|
TIN SILVER COPPER
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
|
Width
|
19 mm
|
