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Overview of LE58QL021VC by Microsemi Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for LE58QL021VC by Microsemi Corporation
Part Data Attributes for LE58QL021VC by Microsemi Corporation
|
|
---|---|
Pbfree Code
|
No
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
MICROSEMI CORP
|
Part Package Code
|
QFP
|
Package Description
|
MS-026ACB, TQFP-44
|
Pin Count
|
44
|
Reach Compliance Code
|
compliant
|
HTS Code
|
8542.39.00.01
|
Companding Law
|
A/MU-LAW
|
Filter
|
YES
|
JESD-30 Code
|
S-PQFP-G44
|
JESD-609 Code
|
e0
|
Length
|
10 mm
|
Number of Functions
|
1
|
Number of Terminals
|
44
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
TQFP
|
Package Shape
|
SQUARE
|
Package Style
|
FLATPACK, THIN PROFILE
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.2 mm
|
Supply Voltage-Nom
|
3.3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Telecom IC Type
|
PCM CODEC
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
0.8 mm
|
Terminal Position
|
QUAD
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Width
|
10 mm
|
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