There are no models available for this part yet.
Overview of LFCPNX-100-8BFG484C by Lattice Semiconductor Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 4 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Telecommunications
Price & Stock for LFCPNX-100-8BFG484C by Lattice Semiconductor Corporation
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
47AK5657
|
Newark | Lattice Certuspro -Nx General Purpose Fpga On Nexus Platform (28Nm Fd-Soi) Rohs Compliant: Yes |Lattice Semiconductor LFCPNX-100-8BFG484C RoHS: Compliant Min Qty: 60 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$98.5000 / $104.6600 | Buy Now | |
DISTI #
220-LFCPNX-100-8BFG484C-ND
|
DigiKey | IC FPGA CERTUSPRO-NX 484BGA Min Qty: 60 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
|
$103.9002 | Buy Now | |
DISTI #
842-FCPNX1008BFG484C
|
Mouser Electronics | FPGA - Field Programmable Gate Array Lattice CertusPro-NX General Purpose FPGA on Nexus platform (28nm FD-SOI) | 0 |
|
$103.9000 | Order Now | |
Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 60 Package Multiple: 60 Lead time: 16 Weeks | 0 |
|
$102.6000 | Buy Now |
CAD Models for LFCPNX-100-8BFG484C by Lattice Semiconductor Corporation
Part Data Attributes for LFCPNX-100-8BFG484C by Lattice Semiconductor Corporation
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
LATTICE SEMICONDUCTOR CORP
|
Reach Compliance Code
|
compliant
|
JESD-30 Code
|
S-PBGA-B484
|
Length
|
23 mm
|
Moisture Sensitivity Level
|
3
|
Number of CLBs
|
12500
|
Number of Inputs
|
299
|
Number of Logic Cells
|
100000
|
Number of Outputs
|
299
|
Number of Terminals
|
484
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
|
Organization
|
12500 CLBS
|
Package Body Material
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PLASTIC/EPOXY
|
Package Code
|
HBGA
|
Package Equivalence Code
|
BGA484,22X22,40
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY, HEAT SINK/SLUG
|
Peak Reflow Temperature (Cel)
|
250
|
Programmable Logic Type
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max
|
2.6 mm
|
Supply Voltage-Max
|
1.05 V
|
Supply Voltage-Min
|
0.95 V
|
Supply Voltage-Nom
|
1 V
|
Surface Mount
|
YES
|
Technology
|
FDSOI
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Width
|
23 mm
|