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Signal Circuits / Other Signal Circuits / LIS331DLHTR
Datasheets
LIS331DLHTR by: STMicroelectronics

3-axis digital accelerometer, ultra low power operational modes, advanced power saving, smart sleep to wake-up functions

Part Details for LIS331DLHTR by STMicroelectronics

Results Overview of LIS331DLHTR by STMicroelectronics

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Applications Education and Research Aerospace and Defense Agriculture Technology Robotics and Drones

LIS331DLHTR Information

LIS331DLHTR by STMicroelectronics is an Other Signal Circuit.
Other Signal Circuits are under the broader part category of Signal Circuits.

A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.

Price & Stock for LIS331DLHTR

Part # Distributor Description Stock Price Buy
DISTI # 09R4847
Newark Accelerometer |Stmicroelectronics LIS331DLHTR RoHS: Not Compliant Min Qty: 4000 Package Multiple: 1 Date Code: 0 Container: Reel 0
Buy Now
DISTI # LIS331DLHTR
Avnet Americas Accelerometer, Triple, ?2/?4/?8g, 1mg/digit/2mg/digit/3.9mg/digit, 2.16V to 3.6V, 16-Pin, LGA - Tape and Reel (Alt: LIS331DLHTR) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 12 Weeks, 0 Days Container: Reel 0
  • 4,000 $1.6900
  • 8,000 $1.6640
  • 16,000 $1.6380
  • 24,000 $1.6120
  • 32,000 $1.5925
$1.5925 / $1.6900 Buy Now
Bristol Electronics   2143
RFQ
ComSIT USA Electronic Component RoHS: Compliant Stock DE - 0
Stock ES - 39
Stock US - 0
Stock MX - 0
Stock CN - 0
Stock HK - 0
RFQ
DISTI # LIS331DLHTR
Avnet Silica Accelerometer, Triple, �2/�4/�8g, 1mg/digit/2mg/digit/3.9mg/digit, 2.16V to 3.6V, 16-Pin, LGA (Alt: LIS331DLHTR) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 13 Weeks, 0 Days Silica - 296000
Buy Now
Chip Stock   4769
RFQ
Chip-Germany GmbH   RoHS: Not Compliant 335
RFQ
DISTI # LIS331DLHTR
EBV Elektronik Accelerometer, Triple, �2/�4/�8g, 1mg/digit/2mg/digit/3.9mg/digit, 2.16V to 3.6V, 16-Pin, LGA (Alt: LIS331DLHTR) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 13 Weeks, 0 Days EBV - 0
Buy Now
LCSC XYZ LGA-16(3x3) Accelerometers ROHS 403
  • 1 $2.6147
  • 10 $2.2705
  • 30 $2.0563
  • 100 $1.8360
  • 500 $1.7381
  • 1,000 $1.6937
$1.6937 / $2.6147 Buy Now
Win Source Electronics Accelerometer Triple ±2g/±4g/±8g 2.5V 16-Pin LGA T/R / ACCELEROMETER 2-8G I2C/SPI 16LGA 91200
  • 60 $0.8732
  • 125 $0.8169
  • 195 $0.7887
  • 275 $0.7324
  • 360 $0.7042
  • 445 $0.6761
$0.6761 / $0.8732 Buy Now

Part Details for LIS331DLHTR

LIS331DLHTR CAD Models

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LIS331DLHTR Part Data Attributes

Parametric Data
LIS331DLHTR STMicroelectronics
Buy Now Datasheet
Compare Parts:
LIS331DLHTR STMicroelectronics 3-axis digital accelerometer, ultra low power operational modes, advanced power saving, smart sleep to wake-up functions
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer STMICROELECTRONICS
Part Package Code LGA
Package Description LGA-16
Pin Count 16
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 12 Weeks
Samacsys Manufacturer STMicroelectronics
Analog IC - Other Type ANALOG CIRCUIT
JESD-30 Code S-PBGA-B16
JESD-609 Code e4
Length 3 mm
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 16
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code VFLGA
Package Equivalence Code LCC16,.12SQ,20
Package Shape SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.16 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Temperature Grade INDUSTRIAL
Terminal Finish Nickel/Gold (Ni/Au) - electrolytic
Terminal Form BUTT
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 3 mm

Alternate Parts for LIS331DLHTR

This table gives cross-reference parts and alternative options found for LIS331DLHTR. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LIS331DLHTR, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
LIS331DLTR STMicroelectronics Check for Price MEMS motion sensor 3-axis - ±2g /±8g smart digital output "nano" accelerometer" LIS331DLHTR vs LIS331DLTR
LIS331DLMTR STMicroelectronics Check for Price MEMS motion sensor: Ultra low power 8bit 3-axis digital accelerometer LIS331DLHTR vs LIS331DLMTR
LIS331DL STMicroelectronics Check for Price MEMS motion sensor 3-axis - ±2g /±8g smart digital output "nano" accelerometer" LIS331DLHTR vs LIS331DL
LIS331DLH STMicroelectronics Check for Price MEMS motion sensor: Ultra low power high performance 3-axis digital accelerometer LIS331DLHTR vs LIS331DLH

LIS331DLHTR Related Parts

LIS331DLHTR Frequently Asked Questions (FAQ)

  • The recommended power-on sequence is to apply VDD first, followed by VDDIO, and then the clock signal. This ensures proper initialization of the device.

  • To configure the LIS331DLHTR for low-power mode, set the LPEN bit in the CTRL_REG1 register to 1. This reduces the current consumption to approximately 10 μA.

  • The self-test feature is used to verify the integrity of the sensor and the analog-to-digital converter (ADC). It applies a known stimulus to the sensor and checks the output to ensure it is within expected limits.

  • Interrupts are generated when the acceleration exceeds a user-defined threshold. To handle interrupts, configure the INT1 and INT2 pins as inputs, and use an external interrupt controller or a microcontroller to service the interrupt.

  • Place the LIS331DLHTR near the center of the PCB, away from high-frequency components and noise sources. Use a ground plane underneath the device to reduce noise and ensure good thermal dissipation.

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