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Part Details for LM66200DRLR by Texas Instruments
Results Overview of LM66200DRLR by Texas Instruments
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
LM66200DRLR Information
LM66200DRLR by Texas Instruments is a Power Management Circuit.
Power Management Circuits are under the broader part category of Power Circuits.
A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| LM66200DRLR | Texas Instruments | 1.6-V to 5.5-V, 40-mΩ, 2.5-A, low-IQ, dual ideal diode 8-SOT-5X3 -40 to 125 |
Part Details for LM66200DRLR
LM66200DRLR CAD Models
LM66200DRLR Part Data Attributes
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LM66200DRLR
Texas Instruments
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Datasheet
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LM66200DRLR
Texas Instruments
1.6-V to 5.5-V, 40-mΩ, 2.5-A, low-IQ, dual ideal diode 8-SOT-5X3 -40 to 125
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Package Description | SOT-5X3, 8 PIN | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | Texas Instruments | |
| Adjustable Threshold | NO | |
| Analog IC - Other Type | POWER SUPPLY SUPPORT CIRCUIT | |
| Input Voltage-Max | 5.5 V | |
| Input Voltage-Min | 1.6 V | |
| JESD-30 Code | R-PDSO-F8 | |
| JESD-609 Code | e3 | |
| Length | 2.1 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Channels | 2 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VSOF | |
| Package Equivalence Code | FL8,.04,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 0.6 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 1.6 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | FLAT | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Threshold Voltage-Nom | +0.042V | |
| Width | 1.2 mm |
LM66200DRLR Frequently Asked Questions (FAQ)
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A good PCB layout for the LM66200DRLR involves keeping the input and output traces separate, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and ensure optimal performance.
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The choice of input and output capacitors for the LM66200DRLR depends on the specific application and the desired performance. In general, X5R or X7R ceramic capacitors with a voltage rating of 10V or higher are recommended. The capacitance value should be chosen based on the desired ripple voltage and the output current requirement.
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The LM66200DRLR is rated for operation over a temperature range of -40°C to 125°C. However, the device's performance and reliability may be affected at extreme temperatures. It's recommended to operate the device within a temperature range of 0°C to 85°C for optimal performance and reliability.
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Yes, the LM66200DRLR is qualified for use in high-reliability and automotive applications. It meets the requirements of the AEC-Q100 standard for automotive applications and is also suitable for use in high-reliability industrial and medical applications.
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To ensure proper soldering and assembly of the LM66200DRLR, follow the recommended soldering profile and assembly guidelines provided in the datasheet. Use a soldering iron with a temperature of 260°C to 280°C, and apply a small amount of solder paste to the PCB pads. Avoid applying excessive heat or pressure, which can damage the device.