Part Details for LMH6550MMX by National Semiconductor Corporation
Overview of LMH6550MMX by National Semiconductor Corporation
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LMH6550MMX
National Semiconductor Corporation
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LMH6550MMX
National Semiconductor Corporation
IC OP-AMP, 4000 uV OFFSET-MAX, PDSO8, MSOP-8, Operational Amplifier
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Part Package Code | SOIC | |
Package Description | MSOP-8 | |
Pin Count | 8 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.33.00.01 | |
Amplifier Type | OPERATIONAL AMPLIFIER | |
Architecture | VOLTAGE-FEEDBACK | |
Average Bias Current-Max (IIB) | 16 µA | |
Bias Current-Max (IIB) @25C | 16 µA | |
Common-mode Reject Ratio-Nom | 82 dB | |
Frequency Compensation | YES | |
Input Offset Voltage-Max | 4000 µV | |
JESD-30 Code | S-PDSO-G8 | |
JESD-609 Code | e0 | |
Length | 3 mm | |
Low-Offset | NO | |
Moisture Sensitivity Level | 1 | |
Neg Supply Voltage Limit-Max | -6.6 V | |
Neg Supply Voltage-Nom (Vsup) | -5 V | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP8,.19 | |
Package Shape | SQUARE | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Packing Method | TAPE AND REEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.09 mm | |
Slew Rate-Min | 2000 V/us | |
Slew Rate-Nom | 3000 V/us | |
Supply Current-Max | 27 mA | |
Supply Voltage Limit-Max | 6.6 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | BIPOLAR | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Lead (Sn85Pb15) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Wideband | YES | |
Width | 3 mm |