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1.34-GHz, low-power, extreme-temperature RF synthesizer with frequency-shift keying (FSK) modulation 36-WQFN -40 to 85
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
LMX2571NJKR by Texas Instruments is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Telecommunications | 5074 |
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RFQ | |
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Win Source Electronics | IC SYNTHESIZER W/FSK MOD 36WQFN / LMX2571 Low-Power, High-Performance PLLatinum™ RF Synthesizer | 14130 |
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$3.0210 / $3.9020 | Buy Now |
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LMX2571NJKR
Texas Instruments
Buy Now
Datasheet
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LMX2571NJKR
Texas Instruments
1.34-GHz, low-power, extreme-temperature RF synthesizer with frequency-shift keying (FSK) modulation 36-WQFN -40 to 85
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Package Description | 6 X 6 MM, GREEN, WQFN-36 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Texas Instruments | |
JESD-30 Code | S-XQCC-N36 | |
JESD-609 Code | e3 | |
Length | 6 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 36 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | HVQCCN | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 0.8 mm | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 6 mm |
This table gives cross-reference parts and alternative options found for LMX2571NJKR. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LMX2571NJKR, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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LMX2571NJKT | Texas Instruments | $6.5676 | 1.34-GHz, low-power, extreme-temperature RF synthesizer with frequency-shift keying (FSK) modulation 36-WQFN -40 to 85 | LMX2571NJKR vs LMX2571NJKT |
A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a star topology for the power supply and keep the decoupling capacitors close to the device.
Use the TI PLL Loop Filter Design Tool or a similar tool to optimize the loop filter design. The tool helps to calculate the component values based on the desired loop bandwidth, phase margin, and other parameters.
Power up the device in the following sequence: VDD, AVDD, and then DVDD. Ensure that the power supplies are stable and within the recommended voltage range before applying the clock signal.
Use a spectrum analyzer to measure the output spectrum and identify any spurious signals. Check the loop filter design and component values. Verify that the power supplies are stable and within the recommended range. Use the device's built-in diagnostic features, such as the lock detect output, to troubleshoot issues.
Use a thermal pad or a heat sink to dissipate heat. Ensure good airflow around the device. Use thermal interface material (TIM) to fill any gaps between the device and the heat sink. Follow the recommended thermal design guidelines in the datasheet.