Datasheets
LMX2571NJKR by:
Texas Instruments

1.34-GHz, low-power, extreme-temperature RF synthesizer with frequency-shift keying (FSK) modulation 36-WQFN -40 to 85

Part Details for LMX2571NJKR by Texas Instruments

Results Overview of LMX2571NJKR by Texas Instruments

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Applications Aerospace and Defense

LMX2571NJKR Information

LMX2571NJKR by Texas Instruments is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.

A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.

Price & Stock for LMX2571NJKR

Part # Distributor Description Stock Price Buy
Vyrian Telecommunications 5074
RFQ
Win Source Electronics IC SYNTHESIZER W/FSK MOD 36WQFN / LMX2571 Low-Power, High-Performance PLLatinum™ RF Synthesizer 14130
  • 13 $3.9020
  • 28 $3.6503
  • 43 $3.5244
  • 62 $3.2727
  • 80 $3.1468
  • 100 $3.0210
$3.0210 / $3.9020 Buy Now

Part Details for LMX2571NJKR

LMX2571NJKR CAD Models

LMX2571NJKR Part Data Attributes

LMX2571NJKR Texas Instruments
Buy Now Datasheet
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LMX2571NJKR Texas Instruments 1.34-GHz, low-power, extreme-temperature RF synthesizer with frequency-shift keying (FSK) modulation 36-WQFN -40 to 85
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer TEXAS INSTRUMENTS INC
Package Description 6 X 6 MM, GREEN, WQFN-36
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer Texas Instruments
JESD-30 Code S-XQCC-N36
JESD-609 Code e3
Length 6 mm
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 36
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Code HVQCCN
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Seated Height-Max 0.8 mm
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Telecom IC Type TELECOM CIRCUIT
Temperature Grade INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 6 mm

Alternate Parts for LMX2571NJKR

This table gives cross-reference parts and alternative options found for LMX2571NJKR. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LMX2571NJKR, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
LMX2571NJKT Texas Instruments $6.5676 1.34-GHz, low-power, extreme-temperature RF synthesizer with frequency-shift keying (FSK) modulation 36-WQFN -40 to 85 LMX2571NJKR vs LMX2571NJKT

LMX2571NJKR Related Parts

LMX2571NJKR Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a star topology for the power supply and keep the decoupling capacitors close to the device.

  • Use the TI PLL Loop Filter Design Tool or a similar tool to optimize the loop filter design. The tool helps to calculate the component values based on the desired loop bandwidth, phase margin, and other parameters.

  • Power up the device in the following sequence: VDD, AVDD, and then DVDD. Ensure that the power supplies are stable and within the recommended voltage range before applying the clock signal.

  • Use a spectrum analyzer to measure the output spectrum and identify any spurious signals. Check the loop filter design and component values. Verify that the power supplies are stable and within the recommended range. Use the device's built-in diagnostic features, such as the lock detect output, to troubleshoot issues.

  • Use a thermal pad or a heat sink to dissipate heat. Ensure good airflow around the device. Use thermal interface material (TIM) to fill any gaps between the device and the heat sink. Follow the recommended thermal design guidelines in the datasheet.

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