There are no models available for this part yet.
Overview of LP3991TL-1.55/NOPB by National Semiconductor Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
DS96174CN/NOPB | Rochester Electronics LLC | DS96174 - Line Driver, 4 Func, 4 Driver, BIPolar, PDIP16 | |
LM611IM/NOPB | Rochester Electronics LLC | LM611IM - Operational Amplifier, 7000uV Offset-Max, BIPolar | |
LP3991TL-1.7/NOPB | Texas Instruments | 300-mA LDO for Digital Applications 4-DSBGA |
Price & Stock for LP3991TL-1.55/NOPB by National Semiconductor Corporation
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
Rochester Electronics | Fixed Positive Standard Regulator, 1.55VCMOS, PBGA4 ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 730 |
|
$0.2707 / $0.3185 | Buy Now |
CAD Models for LP3991TL-1.55/NOPB by National Semiconductor Corporation
Part Data Attributes for LP3991TL-1.55/NOPB by National Semiconductor Corporation
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
NATIONAL SEMICONDUCTOR CORP
|
Reach Compliance Code
|
compliant
|
Adjustability
|
FIXED
|
Input Voltage Absolute-Max
|
6.5 V
|
JESD-30 Code
|
S-PBGA-B4
|
JESD-609 Code
|
e1
|
Line Regulation-Max
|
0.024%
|
Moisture Sensitivity Level
|
1
|
Number of Outputs
|
1
|
Number of Terminals
|
4
|
Operating Temperature TJ-Max
|
125 °C
|
Operating Temperature TJ-Min
|
-40 °C
|
Output Current1-Max
|
0.3 A
|
Output Voltage1-Nom
|
1.55 V
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
FBGA
|
Package Equivalence Code
|
BGA4,2X2,20
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY, FINE PITCH
|
Packing Method
|
TR
|
Peak Reflow Temperature (Cel)
|
260
|
Qualification Status
|
Not Qualified
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Terminal Finish
|
TIN SILVER COPPER
|
Terminal Form
|
BALL
|
Terminal Pitch
|
0.5 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
40
|
Voltage Tolerance-Max
|
3%
|