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Overview of LPC2458FET180,529 by NXP Semiconductors
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
CAD Models for LPC2458FET180,529 by NXP Semiconductors
Part Data Attributes for LPC2458FET180,529 by NXP Semiconductors
|
|
---|---|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
Part Package Code
|
BGA
|
Package Description
|
12 X 12 MM, 0.80 MM HEIGHT, SOT570-2, TFBGA-180
|
Pin Count
|
180
|
Manufacturer Package Code
|
SOT570-3
|
Reach Compliance Code
|
unknown
|
Has ADC
|
YES
|
Address Bus Width
|
20
|
Bit Size
|
32
|
DAC Channels
|
YES
|
DMA Channels
|
YES
|
External Data Bus Width
|
16
|
JESD-30 Code
|
S-PBGA-B180
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Length
|
12 mm
|
Number of I/O Lines
|
136
|
Number of Terminals
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180
|
PWM Channels
|
YES
|
Package Body Material
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PLASTIC/EPOXY
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Package Code
|
TFBGA
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Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
ROM Programmability
|
FLASH
|
Seated Height-Max
|
1.2 mm
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Terminal Form
|
BALL
|
Terminal Pitch
|
0.8 mm
|
Terminal Position
|
BOTTOM
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Width
|
12 mm
|
uPs/uCs/Peripheral ICs Type
|
MICROCONTROLLER, RISC
|