Part Details for LPC2458FET180,529 by NXP Semiconductors
Overview of LPC2458FET180,529 by NXP Semiconductors
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for LPC2458FET180,529
LPC2458FET180,529 CAD Models
LPC2458FET180,529 Part Data Attributes
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LPC2458FET180,529
NXP Semiconductors
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Datasheet
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LPC2458FET180,529
NXP Semiconductors
LPC2458 - Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface BGA 180-Pin
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Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | BGA | |
Package Description | 12 X 12 MM, 0.80 MM HEIGHT, SOT570-2, TFBGA-180 | |
Pin Count | 180 | |
Manufacturer Package Code | SOT570-3 | |
Reach Compliance Code | unknown | |
Has ADC | YES | |
Address Bus Width | 20 | |
Bit Size | 32 | |
DAC Channels | YES | |
DMA Channels | YES | |
External Data Bus Width | 16 | |
JESD-30 Code | S-PBGA-B180 | |
Length | 12 mm | |
Number of I/O Lines | 136 | |
Number of Terminals | 180 | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.2 mm | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 12 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |