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LPC4357/53/37/33 - 32-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 136 kB SRAM; Ethernet, two High-speed USB, LCD, EMC BGA 256-Pin
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2218113
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Farnell | MCU, 32BIT, CORTEX-M4, 204MHZ, LBGA-256 RoHS: Compliant Min Qty: 1 Lead time: 14 Weeks, 1 Days Container: Each | 593 |
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$9.8524 / $10.2979 | Buy Now |
DISTI #
LPC4337FET256,551
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Avnet Americas | MCU 32-bit LPC4300 ARM Cortex M4/M0 RISC 1024KB Flash 2.5V/3.3V 256-Pin LBGA Tray - Trays (Alt: LPC4337FET256,551) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
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$10.8299 / $11.7600 | Buy Now |
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Bristol Electronics | 21 |
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RFQ | ||
DISTI #
LPC4337FET256.551
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TME | IC: ARM microcontroller, 136kBSRAM,1MBFLASH, LBGA256, 2.2÷3.6VDC Min Qty: 1 | 0 |
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$15.1200 / $20.3800 | RFQ |
DISTI #
LPC4337FET256,551
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Avnet Silica | (Alt: LPC4337FET256,551) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Lead time: 15 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
LPC4337FET256,551
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EBV Elektronik | (Alt: LPC4337FET256,551) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Lead time: 15 Weeks, 0 Days | EBV - 0 |
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Buy Now |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
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LPC4337FET256,551
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LPC4337FET256,551
NXP Semiconductors
LPC4357/53/37/33 - 32-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 136 kB SRAM; Ethernet, two High-speed USB, LCD, EMC BGA 256-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | BGA | |
Package Description | 17 X 17 MM, 1 MM HEIGHT, PLASTIC, SOT740-2, MO-192, LBGA-256 | |
Pin Count | 256 | |
Manufacturer Package Code | SOT740-2 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 13 Weeks | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | 24 | |
Bit Size | 32 | |
CPU Family | CORTEX-M4 | |
Clock Frequency-Max | 25 MHz | |
DAC Channels | YES | |
DMA Channels | YES | |
External Data Bus Width | 32 | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 164 | |
Number of Terminals | 256 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 139264 | |
ROM (words) | 1048576 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.55 mm | |
Speed | 204 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3.3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 17 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |