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SPECIALTY MICROPROCESSOR CIRCUIT, PBGA525
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
568-14187-ND
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DigiKey | IC MPU QORIQ 1.0GHZ 525FCPBGA Min Qty: 1 Lead time: 18 Weeks Container: Tray |
290 In Stock |
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$43.2802 / $58.6600 | Buy Now |
DISTI #
LS1021ASN7KQB
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Avnet Americas | Communication Processor 525-Pin FCBGA Box - Trays (Alt: LS1021ASN7KQB) RoHS: Compliant Min Qty: 84 Package Multiple: 1 Lead time: 18 Weeks, 0 Days Container: Tray | 43 |
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$37.9544 / $43.7700 | Buy Now |
DISTI #
841-LS1021ASN7KQB
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Mouser Electronics | Microprocessors - MPU Layerscape 32-bit Arm Cortex-A7, Dual-core, 1.0GHz, 0 to 105C, Security disabled RoHS: Compliant | 85 |
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$43.2800 / $58.6600 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 84 Package Multiple: 84 Container: Tray | 0Tray |
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$40.8200 | Buy Now |
DISTI #
LS1021ASN7KQB
|
Avnet Americas | Communication Processor 525-Pin FCBGA Box - Trays (Alt: LS1021ASN7KQB) RoHS: Compliant Min Qty: 84 Package Multiple: 1 Lead time: 18 Weeks, 0 Days Container: Tray | 43 |
|
$37.9544 / $43.7700 | Buy Now |
DISTI #
LS1021ASN7KQB
|
Avnet Americas | Communication Processor 525-Pin FCBGA Box - Trays (Alt: LS1021ASN7KQB) RoHS: Compliant Min Qty: 84 Package Multiple: 1 Lead time: 18 Weeks, 0 Days Container: Tray | 43 |
|
$37.9544 / $43.7700 | Buy Now |
DISTI #
LS1021ASN7KQB
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Avnet Silica | Communication Processor 525-Pin FCBGA Box (Alt: LS1021ASN7KQB) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 2 Weeks, 6 Days | Silica - 0 |
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Buy Now | |
DISTI #
LS1021ASN7KQB
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EBV Elektronik | Communication Processor 525-Pin FCBGA Box (Alt: LS1021ASN7KQB) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 2 Weeks, 6 Days | EBV - 0 |
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Buy Now |
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LS1021ASN7KQB
NXP Semiconductors
Buy Now
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LS1021ASN7KQB
NXP Semiconductors
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA525
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | 19 X 19 MM, 1.92 HEIGHT, PLASTIC, FCBGA-525 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.1 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 18 Weeks | |
Samacsys Manufacturer | NXP | |
JESD-30 Code | S-PBGA-B525 | |
JESD-609 Code | e1 | |
Length | 19 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 525 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 2.07 mm | |
Supply Voltage-Max | 1.03 V | |
Supply Voltage-Min | 0.97 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 19 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |