Part Details for LS1026ASE8P1A by NXP Semiconductors
Overview of LS1026ASE8P1A by NXP Semiconductors
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for LS1026ASE8P1A
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
LS1026ASE8P1A-ND
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DigiKey | IC MPU QORIQ 1.4GHZ 780FCPBGA Min Qty: 60 Lead time: 18 Weeks Container: Tray | Temporarily Out of Stock |
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$74.2368 | Buy Now |
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DISTI #
LS1026ASE8P1A
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Avnet Americas | LS1026A STWE1.4G DDR2100 - Trays (Alt: LS1026ASE8P1A) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 18 Weeks, 0 Days Container: Tray | 0 |
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$62.0015 / $71.5017 | Buy Now |
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DISTI #
841-LS1026ASE8P1A
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Mouser Electronics | Microprocessors - MPU Layerscape 64-bit Arm Cortex-A72, Dual-core, 1.4GHz, 0 to 105C, Security enabled RoHS: Compliant | 0 |
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$74.2400 | Order Now |
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Future Electronics | Layerscape 64-bit Arm Cortex-A72, Dual-core, 1.4GHz, 0 to 105C, Security enabled RoHS: Compliant pbFree: Yes Min Qty: 60 Package Multiple: 60 Lead time: 18 Weeks Container: Tray | 0Tray |
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$62.5100 | Buy Now |
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DISTI #
LS1026ASE8P1A
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Avnet Silica | LS1026A STWE1.4G DDR2100 (Alt: LS1026ASE8P1A) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 20 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
LS1026ASE8P1A
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EBV Elektronik | LS1026A STWE1.4G DDR2100 (Alt: LS1026ASE8P1A) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 20 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for LS1026ASE8P1A
LS1026ASE8P1A CAD Models
LS1026ASE8P1A Part Data Attributes
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LS1026ASE8P1A
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LS1026ASE8P1A
NXP Semiconductors
Multifunction Peripheral, CMOS, PBGA780
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | FCBGA-780 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 18 Weeks | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | S-PBGA-B780 | |
| JESD-609 Code | e1 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 780 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA780,28X28,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 250 | |
| Seated Height-Max | 2.07 mm | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 0.97 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |