Datasheets
LSF0204PWR by: Texas Instruments

4-Bit Bidirectional Multi-Voltage Level Translator for Open-Drain & Push- Pull 14-TSSOP -40 to 125

Part Details for LSF0204PWR by Texas Instruments

Results Overview of LSF0204PWR by Texas Instruments

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Applications Consumer Electronics Computing and Data Storage Healthcare Medical Imaging

LSF0204PWR Information

LSF0204PWR by Texas Instruments is an Other Interface IC.
Other Interface ICs are under the broader part category of Drivers And Interfaces.

A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.

Price & Stock for LSF0204PWR

Part # Distributor Description Stock Price Buy
Ameya Holding Limited IC TRNSLTR BIDIRECTIONAL 14TSSOP 2000
Buy Now RFQ
Vyrian Interface ICs 47306
RFQ

Part Details for LSF0204PWR

LSF0204PWR CAD Models

LSF0204PWR Part Data Attributes

LSF0204PWR Texas Instruments
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LSF0204PWR Texas Instruments 4-Bit Bidirectional Multi-Voltage Level Translator for Open-Drain & Push- Pull 14-TSSOP -40 to 125
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer TEXAS INSTRUMENTS INC
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Interface IC Type INTERFACE CIRCUIT
JESD-30 Code R-PDSO-G14
JESD-609 Code e3
Length 5 mm
Moisture Sensitivity Level 1
Number of Bits 4
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP14,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Supply Current-Max 0.0125 mA
Surface Mount YES
Temperature Grade AUTOMOTIVE
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm

Alternate Parts for LSF0204PWR

This table gives cross-reference parts and alternative options found for LSF0204PWR. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LSF0204PWR, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
LSF0204DRGYR Texas Instruments $0.3885 4-Bit Bidirectional Multi-Voltage Level Translator for Open-Drain & Push-Pull 14-VQFN -40 to 125 LSF0204PWR vs LSF0204DRGYR
LSF0204RGYR Texas Instruments $0.3885 4-Bit Bidirectional Multi-Voltage Level Translator for Open-Drain & Push- Pull 14-VQFN -40 to 125 LSF0204PWR vs LSF0204RGYR
LSF0204DRUTR Texas Instruments $0.3885 4-Bit Bidirectional Multi-Voltage Level Translator for Open-Drain & Push-Pull 12-UQFN -40 to 125 LSF0204PWR vs LSF0204DRUTR
LSF0204GU12 Nexperia Check for Price Interface Circuit LSF0204PWR vs LSF0204GU12

LSF0204PWR Related Parts

LSF0204PWR Frequently Asked Questions (FAQ)

  • A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. This helps to dissipate heat efficiently and reduces thermal resistance.

  • Ensure that the device is operated within the recommended operating temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling capability at high temperatures.

  • The maximum allowable voltage on the input pins is 5.5V. Exceeding this voltage may cause damage to the device or affect its reliability.

  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines to protect the device from electrostatic discharge. Follow proper PCB layout and handling practices to minimize ESD risks.

  • Follow the recommended soldering temperature profile: 260°C (peak temperature), 3°C/s (ramp rate), and 60-90 seconds (dwell time) to ensure reliable solder joints.

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