Part Details for LSM303AGR by STMicroelectronics
Overview of LSM303AGR by STMicroelectronics
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Available)
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Applications
Education and Research
Aerospace and Defense
Agriculture Technology
Robotics and Drones
Price & Stock for LSM303AGR
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
LSM303AGR
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Avnet Americas | Ultra-compact high-performance eCompass IC (accelerometer & magnetometer) - Trays (Alt: LSM303AGR) RoHS: Compliant Min Qty: 2940 Package Multiple: 2940 Container: Tray | 0 |
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RFQ | |
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DISTI #
LSM303AGR
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Avnet Americas | Ultra-compact high-performance eCompass IC (accelerometer & magnetometer) - Trays (Alt: LSM303AGR) RoHS: Compliant Min Qty: 2940 Package Multiple: 2940 Container: Tray | 0 |
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RFQ | |
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DISTI #
SMC-LSM303AGR
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Sensible Micro Corporation | AS6081 Certified Vendor, 1 Yr Warranty RoHS: Not Compliant Min Qty: 25 Lead time: 2 Weeks, 0 Days | 18966 |
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RFQ | |
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Win Source Electronics | IMUs Inertial Measurement Units CONSUME MEMS | 5 |
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Buy Now |
Part Details for LSM303AGR
LSM303AGR CAD Models
LSM303AGR Part Data Attributes:
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LSM303AGR
STMicroelectronics
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Datasheet
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LSM303AGR
STMicroelectronics
Ultra-compact high-performance eCompass module: ultra-low power 3D accelerometer and 3D magnetometer
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Package Description | VFLGA, | |
| Manufacturer Package Code | LGA 2X2X1 12LD PITCH 0.5MM | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | STMicroelectronics | |
| Analog IC - Other Type | ANALOG CIRCUIT | |
| JESD-30 Code | S-PBGA-B12 | |
| JESD-609 Code | e4 | |
| Length | 2 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 12 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFLGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 1.71 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | BUTT | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 2 mm |
Resources and Additional Insights for LSM303AGR
Reference Designs related to LSM303AGR
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IO-Link for Industrial Sensors
This self-contained and ready-to-use modern industrial sensor solution implements multi-sensing functionality with embedded LSM6DSL 3D accelerometer and 3D gyroscope, LSM303AGR 3D accelerometer and 3D magnetometer, LPS22HB pressure sensor, and HTS221 humidity and temperature sensors, along with the L6362A physical IO-Link transceiver and STM32L073RZT6 microcontroller hosting the relevant protocol stack.<p>The node complies with the definition of an IO-Link device according to the provisioning protocols defined by the standard and facilitates expansion with additional sensors to extend the range of data supplied by the node.<p>The architecture represents a smart sensor node capable of monitoring equipment status, with all the benefits of the IO-Link industrial communication standard, including automatic node configuration, hot plug automatic device recognition, and several diagnostics features