Datasheets
LTC2861IGN#PBF by:

20Mbps RS485 Transceivers with Integrated Switchable Termination

Part Details for LTC2861IGN#PBF by Analog Devices Inc

Results Overview of LTC2861IGN#PBF by Analog Devices Inc

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Applications Industrial Automation

LTC2861IGN#PBF Information

LTC2861IGN#PBF by Analog Devices Inc is a Line Driver or Receiver.
Line Driver or Receivers are under the broader part category of Drivers And Interfaces.

A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.

Price & Stock for LTC2861IGN#PBF

Part # Distributor Description Stock Price Buy
DISTI # 50AK2556
Newark Rs422/Rs485 Transceiver, -40 To 85Deg C, Ic Type:Rs422/Rs485 Transceiver, No. Of Receivers:1Receivers, No. Of Transmitters:1, Communication Mode:Full Duplex, Data Rate Max:20Mbps, Supply Voltage Min:4.5V, Supply Voltage Max:5.5V Rohs Compliant: Yes |Analog Devices LTC2861IGN#PBF RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk 190
  • 1 $6.6000
  • 10 $4.6700
  • 25 $4.4300
  • 50 $4.2000
  • 100 $3.9600
  • 300 $3.4500
  • 500 $3.3500
$3.3500 / $6.6000 Buy Now
Analog Devices Inc 20Mbps RS485 Trans w/ Int Swit Package Multiple: 100 440
  • 1 $7.7600
  • 10 $5.3100
  • 25 $4.6764
  • 100 $3.9670
  • 250 $3.6230
  • 500 $3.4133
  • 1,000 $3.2393
  • 2,500 $3.0875
$3.0875 / $7.7600 Buy Now
DISTI # LTC2861IGN#PBF
Richardson RFPD INTERFACE - TRANSCEIVER RoHS: Compliant Min Qty: 200 0
  • 200 $3.5000
  • 500 $3.4100
  • 1,000 $3.3200
  • 5,000 $3.1900
$3.1900 / $3.5000 Buy Now

Part Details for LTC2861IGN#PBF

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LTC2861IGN#PBF Part Data Attributes

LTC2861IGN#PBF Analog Devices Inc
Buy Now Datasheet
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LTC2861IGN#PBF Analog Devices Inc 20Mbps RS485 Transceivers with Integrated Switchable Termination
Pbfree Code No
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ANALOG DEVICES INC
Package Description 0.150 INCH, LEAD FREE, PLASTIC, SSOP-16
Pin Count 16
Manufacturer Package Code 05-08-1641 (GN16)
Reach Compliance Code compliant
Samacsys Manufacturer Analog Devices
Differential Output YES
Driver Number of Bits 1
Input Characteristics DIFFERENTIAL SCHMITT TRIGGER
Interface IC Type LINE TRANSCEIVER
Interface Standard EIA-485-A; TIA-485-A; EIA-422
JESD-30 Code R-PDSO-G16
JESD-609 Code e3
Length 4.8895 mm
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 16
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code SSOP
Package Equivalence Code SSOP16,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Receive Delay-Max 70 ns
Receiver Number of Bits 1
Seated Height-Max 1.75 mm
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 0.635 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Transmit Delay-Max 50 ns
Width 3.899 mm

LTC2861IGN#PBF Related Parts

LTC2861IGN#PBF Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and a separate analog ground plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a star topology for the power supply connections and keep the input and output capacitors close to the IC.

  • Ensure the input voltage is within the recommended range (2.7V to 5.5V). Use a 0.1uF capacitor between the VCC pin and GND. Configure the EN pin to enable the device. Use a 1kΩ resistor between the EN pin and VCC to ensure proper startup.

  • Use a 1uF to 10uF input capacitor (CIN) and a 1uF to 10uF output capacitor (COUT) with an ESR of 0.1Ω to 1Ω. The capacitor values depend on the specific application and output current requirements.

  • Use a thermal pad or a heat sink to dissipate heat. Ensure good airflow around the device. Keep the device away from other heat sources. Use a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.

  • Use a shielded enclosure and keep the device away from radiating sources. Use a common-mode choke or a ferrite bead on the input and output lines. Ensure good PCB layout and decoupling to minimize radiated emissions.

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