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LTM8083IY#PBF by: Analog Devices Inc

LTM8083IY#PBF

Part Details for LTM8083IY#PBF by Analog Devices Inc

Results Overview of LTM8083IY#PBF by Analog Devices Inc

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LTM8083IY#PBF Information

LTM8083IY#PBF by Analog Devices Inc is a Switching Regulator or Controller.
Switching Regulator or Controllers are under the broader part category of Power Circuits.

A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.

Price & Stock for LTM8083IY#PBF

Part # Distributor Description Stock Price Buy
DISTI # 50AK4477
Newark Dc-Dc Converter, 1V-36V, 1.5A, Power Supply Applications:Industrial, Dc/Dc Converter Type:Bga-49, Micro Module, Output Power Max:-, Output Voltage Min:1V, Output Voltage Max:36V, Output Current Max:1.5A, Input Voltage Dc Min:3V Rohs Compliant: Yes |Analog Devices LTM8083IY#PBF RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk 333
  • 1 $22.9300
  • 5 $19.6800
  • 10 $16.4300
  • 25 $14.7300
  • 50 $14.2100
  • 100 $13.6900
$13.6900 / $22.9300 Buy Now
Analog Devices Inc 36Vin, 1.25A Buck-Boost µModul Package Multiple: 260 0
  • 1 $24.7600
  • 10 $18.2490
  • 25 $16.5796
  • 1,000 $10.9500
$10.9500 / $24.7600 Buy Now
DISTI # LTM8083IY#PBF
Richardson RFPD POWER MANAGEMENT IC RoHS: Compliant Min Qty: 260 0
  • 260 $15.5100
  • 500 $15.1000
  • 1,000 $14.7000
  • 5,000 $14.1400
$14.1400 / $15.5100 Buy Now

Part Details for LTM8083IY#PBF

LTM8083IY#PBF CAD Models

LTM8083IY#PBF Part Data Attributes

LTM8083IY#PBF Analog Devices Inc
Buy Now Datasheet
Compare Parts:
LTM8083IY#PBF Analog Devices Inc LTM8083IY#PBF
Pbfree Code No
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ANALOG DEVICES INC
Package Description BGA-49
Pin Count 49
Manufacturer Package Code 05-08-1518
Reach Compliance Code compliant
Samacsys Manufacturer Analog Devices
Analog IC - Other Type SWITCHING REGULATOR
Control Mode CURRENT-MODE
Control Technique PULSE WIDTH MODULATION
Input Voltage-Max 36 V
Input Voltage-Min 3 V
Input Voltage-Nom 6 V
JESD-30 Code S-PBGA-B49
Length 6.25 mm
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 49
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Output Voltage-Max 36 V
Output Voltage-Min 1 V
Output Voltage-Nom 12 V
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA49,7X7,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Seated Height-Max 2.42 mm
Surface Mount YES
Switcher Configuration BUCK-BOOST
Switching Frequency-Max 2000 kHz
Technology HYBRID
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 6.25 mm

LTM8083IY#PBF Frequently Asked Questions (FAQ)

  • A good PCB layout for the LTM8083IY#PBF should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour coverage around the device. Avoid routing high-current traces under the device, and use thermal vias to dissipate heat.

  • To ensure reliable start-up and shutdown, ensure that the input voltage rises monotonically and exceeds the undervoltage lockout (UVLO) threshold. Also, ensure that the input voltage is stable and within the recommended operating range before enabling the device.

  • When selecting the output inductor and capacitor values, consider the desired output voltage ripple, inductor core loss, and capacitor ESR. A good starting point is to use the recommended values in the datasheet, and then optimize based on the specific application requirements.

  • To minimize EMI, use a shielded inductor, keep the switching node (SW) away from sensitive nodes, and use a common-mode choke or ferrite bead on the input lines. Also, ensure good PCB layout practices, such as separating high-frequency and low-frequency circuits.

  • For thermal design and heat sinking, consider the device's power dissipation, junction temperature, and thermal resistance. Use a heat sink with a low thermal resistance, and ensure good thermal interface material (TIM) between the device and heat sink.

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