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Part Details for LTV-816M by Lite-On Semiconductor Corporation
Results Overview of LTV-816M by Lite-On Semiconductor Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (4 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Space Technology
Aerospace and Defense
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
LTV-816M Information
LTV-816M by Lite-On Semiconductor Corporation is an Optocoupler.
Optocoupler are under the broader part category of Optoelectronics.
Optoelectronic components work to detect, generate, and control light. They can essentially produce and/or react to light. Read more about Optoelectronics on our Optoelectronics part category page.
Price & Stock for LTV-816M
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
LTV-816M
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Avnet Americas | - Rail/Tube (Alt: LTV-816M) RoHS: Compliant Min Qty: 5000 Package Multiple: 100 Lead time: 8 Weeks, 0 Days Container: Tube | 0 |
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$0.0762 / $0.0838 | Buy Now |
Part Details for LTV-816M
LTV-816M CAD Models
LTV-816M Part Data Attributes
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LTV-816M
Lite-On Semiconductor Corporation
Buy Now
Datasheet
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Compare Parts:
LTV-816M
Lite-On Semiconductor Corporation
Transistor Output Optocoupler, 1-Element, 5000V Isolation, ROHS COMPLIANT, DIP-4
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | LITE-ON TECHNOLOGY CORP | |
| Package Description | ROHS COMPLIANT, DIP-4 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8541.40.80.00 | |
| Factory Lead Time | 8 Weeks | |
| Samacsys Manufacturer | Lite-On | |
| Additional Feature | UL APPROVED, VDE APPROVED | |
| Coll-Emtr Bkdn Voltage-Min | 80 V | |
| Configuration | SINGLE | |
| Current Transfer Ratio-Min | 50% | |
| Current Transfer Ratio-Nom | 50% | |
| Dark Current-Max | 100 nA | |
| Forward Current-Max | 0.05 A | |
| Forward Voltage-Max | 1.4 V | |
| Isolation Voltage-Max | 5000 V | |
| Mounting Feature | THROUGH HOLE MOUNT | |
| Number of Elements | 1 | |
| On-State Current-Max | 0.05 A | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -30 °C | |
| Optoelectronic Device Type | TRANSISTOR OUTPUT OPTOCOUPLER | |
| Power Dissipation-Max | 0.2 W | |
| Response Time-Max | 0.000018 s | |
| Surface Mount | NO |
Alternate Parts for LTV-816M
This table gives cross-reference parts and alternative options found for LTV-816M. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LTV-816M, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| LTV-816L-V | Lite-On Semiconductor Corporation | Check for Price | 1 CHANNEL TRANSISTOR OUTPUT OPTOCOUPLER, DIP-4 | LTV-816M vs LTV-816L-V |
| LTV-816D-V | Lite-On Semiconductor Corporation | Check for Price | 1 CHANNEL TRANSISTOR OUTPUT OPTOCOUPLER, DIP-4 | LTV-816M vs LTV-816D-V |
| LTV-816D | Lite-On Semiconductor Corporation | Check for Price | 1 CHANNEL TRANSISTOR OUTPUT OPTOCOUPLER, DIP-4 | LTV-816M vs LTV-816D |
| LTV816M | Lite-On Semiconductor Corporation | Check for Price | 1 CHANNEL TRANSISTOR OUTPUT OPTOCOUPLER, ROHS COMPLIANT, DIP-4 | LTV-816M vs LTV816M |
LTV-816M Frequently Asked Questions (FAQ)
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A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure efficient heat dissipation.
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Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
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Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potentially catastrophic failure. It is essential to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
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Implement ESD protection measures such as using ESD-sensitive handling procedures, using anti-static packaging and storage, and incorporating ESD protection devices (e.g., TVS diodes) in the circuit design.
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Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 60s, and time above 183°C 150s. Ensure that the soldering process is controlled to prevent overheating or thermal shock.