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Overview of M2GL150TS-1FCS536 by Microsemi Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Financial Technology (Fintech)
Computing and Data Storage
Smart Cities
Aerospace and Defense
Telecommunications
Communication and Networking
Automotive
CAD Models for M2GL150TS-1FCS536 by Microsemi Corporation
Part Data Attributes for M2GL150TS-1FCS536 by Microsemi Corporation
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
MICROSEMI CORP
|
Package Description
|
BGA,
|
Reach Compliance Code
|
compliant
|
HTS Code
|
8542.39.00.01
|
JESD-30 Code
|
S-PBGA-B536
|
Number of Terminals
|
536
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Equivalence Code
|
BGA536,30X30,20
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Peak Reflow Temperature (Cel)
|
240
|
Programmable Logic Type
|
FIELD PROGRAMMABLE GATE ARRAY
|
Supply Voltage-Max
|
1.26 V
|
Supply Voltage-Min
|
1.14 V
|
Supply Voltage-Nom
|
1.2 V
|
Surface Mount
|
YES
|
Temperature Grade
|
OTHER
|
Terminal Form
|
BALL
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
20
|