Part Details for M2S010-VF256 by Microsemi Corporation
Overview of M2S010-VF256 by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for M2S010-VF256
M2S010-VF256 CAD Models
M2S010-VF256 Part Data Attributes
|
M2S010-VF256
Microsemi Corporation
Buy Now
Datasheet
|
Compare Parts:
M2S010-VF256
Microsemi Corporation
Field Programmable Gate Array, 12084-Cell, CMOS, PBGA256, VFBGA-256
|
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | LFBGA, BGA256,16X16,32 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Microsemi Corporation | |
Additional Feature | LG-MIN, WD-MIN | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e0 | |
Length | 14 mm | |
Number of Inputs | 138 | |
Number of Logic Cells | 12084 | |
Number of Outputs | 138 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA256,16X16,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 240 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.56 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 14 mm |