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Overview of M2S010-VF256I by Microsemi Corporation
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
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- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for M2S010-VF256I by Microsemi Corporation
Part Data Attributes for M2S010-VF256I by Microsemi Corporation
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
MICROSEMI CORP
|
Package Description
|
LFBGA, BGA256,16X16,32
|
Reach Compliance Code
|
not_compliant
|
HTS Code
|
8542.39.00.01
|
Additional Feature
|
LG-MIN, WD-MIN
|
JESD-30 Code
|
S-PBGA-B256
|
JESD-609 Code
|
e0
|
Length
|
14 mm
|
Number of Inputs
|
138
|
Number of Logic Cells
|
12084
|
Number of Outputs
|
138
|
Number of Terminals
|
256
|
Operating Temperature-Max
|
100 °C
|
Operating Temperature-Min
|
-40 °C
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LFBGA
|
Package Equivalence Code
|
BGA256,16X16,32
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel)
|
240
|
Programmable Logic Type
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.56 mm
|
Supply Voltage-Max
|
1.26 V
|
Supply Voltage-Min
|
1.14 V
|
Supply Voltage-Nom
|
1.2 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
Terminal Form
|
BALL
|
Terminal Pitch
|
0.8 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
14 mm
|
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