Part Details for M2S050-FCS325I by Microsemi Corporation
Overview of M2S050-FCS325I by Microsemi Corporation
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Applications
Computing and Data Storage
Part Details for M2S050-FCS325I
M2S050-FCS325I CAD Models
M2S050-FCS325I Part Data Attributes
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M2S050-FCS325I
Microsemi Corporation
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Datasheet
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M2S050-FCS325I
Microsemi Corporation
Field Programmable Gate Array, 56340-Cell, CMOS, PBGA325, FBGA-325
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | TFBGA, BGA325,21X21,20 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Microsemi Corporation | |
| Additional Feature | LG-MIN, WD-MIN | |
| JESD-30 Code | S-PBGA-B325 | |
| JESD-609 Code | e0 | |
| Length | 11 mm | |
| Number of Inputs | 200 | |
| Number of Logic Cells | 56340 | |
| Number of Outputs | 200 | |
| Number of Terminals | 325 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA325,21X21,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 240 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.01 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 11 mm |