Part Details for M2S060T-1VFG400 by Microsemi Corporation
Overview of M2S060T-1VFG400 by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Financial Technology (Fintech)
Computing and Data Storage
Smart Cities
Aerospace and Defense
Telecommunications
Communication and Networking
Automotive
Part Details for M2S060T-1VFG400
M2S060T-1VFG400 CAD Models
M2S060T-1VFG400 Part Data Attributes
|
M2S060T-1VFG400
Microsemi Corporation
Buy Now
Datasheet
|
Compare Parts:
M2S060T-1VFG400
Microsemi Corporation
Field Programmable Gate Array, 56520-Cell, CMOS, PBGA400, VFBGA-400
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | LFBGA, BGA400,20X20,32 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-PBGA-B400 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of Inputs | 207 | |
Number of Logic Cells | 56520 | |
Number of Outputs | 207 | |
Number of Terminals | 400 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA400,20X20,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 250 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.51 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 17 mm |