Part Details for M2S060TS-1FGG484 by Microsemi Corporation
Overview of M2S060TS-1FGG484 by Microsemi Corporation
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Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Financial Technology (Fintech)
Computing and Data Storage
Smart Cities
Aerospace and Defense
Telecommunications
Communication and Networking
Automotive
Part Details for M2S060TS-1FGG484
M2S060TS-1FGG484 CAD Models
M2S060TS-1FGG484 Part Data Attributes
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M2S060TS-1FGG484
Microsemi Corporation
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M2S060TS-1FGG484
Microsemi Corporation
Field Programmable Gate Array, 56520-Cell, CMOS, PBGA484, FBGA-484
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | BGA, BGA484,22X22,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Microsemi Corporation | |
JESD-30 Code | S-PBGA-B484 | |
JESD-609 Code | e1 | |
Length | 23 mm | |
Moisture Sensitivity Level | 3 | |
Number of Inputs | 267 | |
Number of Logic Cells | 56520 | |
Number of Outputs | 267 | |
Number of Terminals | 484 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 250 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.44 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 23 mm |