Part Details for m3062cf8tgp-b by Renesas Electronics Corporation
Overview of m3062cf8tgp-b by Renesas Electronics Corporation
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Part Details for m3062cf8tgp-b
m3062cf8tgp-b CAD Models
m3062cf8tgp-b Part Data Attributes
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M3062CF8TGP-B
Renesas Electronics Corporation
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M3062CF8TGP-B
Renesas Electronics Corporation
16-BIT, FLASH, 24MHz, MICROCONTROLLER, PQFP100, 14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100
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| Source Content uid | M3062CF8TGP-B | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | QFP | |
| Package Description | 14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | 20 | |
| Bit Size | 16 | |
| Clock Frequency-Max | 16 MHz | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| External Data Bus Width | 16 | |
| JESD-30 Code | S-PQFP-G100 | |
| Length | 14 mm | |
| Number of I/O Lines | 88 | |
| Number of Terminals | 100 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.7 mm | |
| Speed | 24 MHz | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |