Part Details for MAX13042EEBC+ by Analog Devices Inc
Overview of MAX13042EEBC+ by Analog Devices Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MAX13042EEBC+
Part # | Distributor | Description | Stock | Price | Buy | |
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Analog Devices Inc | 1.62V to 3.6V Improved High-Sp Min Qty: 1 Package Multiple: 1 | 0 |
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Part Details for MAX13042EEBC+
MAX13042EEBC+ CAD Models
MAX13042EEBC+ Part Data Attributes:
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MAX13042EEBC+
Analog Devices Inc
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Datasheet
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MAX13042EEBC+
Analog Devices Inc
1.62V to 3.6V Improved High-Speed LLT, 12-WLCSP-N/A, 12 Pins, -40 to 85C
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Part Package Code | 12-WLCSP-N/A | |
Pin Count | 12 | |
Manufacturer Package Code | 12-WLCSP-N/A | |
Date Of Intro | 2007-05-15 | |
Interface IC Type | INTERFACE CIRCUIT | |
JESD-30 Code | R-PBGA-B12 | |
JESD-609 Code | e1 | |
Length | 2.12 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 12 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 0.67 mm | |
Supply Voltage-Max | 3.2 V | |
Supply Voltage-Min | 1.62 V | |
Supply Voltage-Nom | 1.8 V | |
Supply Voltage1-Max | 3.6 V | |
Supply Voltage1-Min | 2.2 V | |
Supply Voltage1-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | BICMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 1.54 mm |