Part Details for MAX3750CEE+T by Analog Devices Inc
Overview of MAX3750CEE+T by Analog Devices Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Communication and Networking
Automotive
Price & Stock for MAX3750CEE+T
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
700-MAX3750CEET
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Mouser Electronics | Interface - Specialized +3.3V, 2.125Gbps/1.0625Gbps Fibre-Channel Port Bypass ICs RoHS: Compliant | 0 |
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$7.7500 | Order Now |
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Analog Devices Inc | +3.3V, 2.125Gbps/1.0625Gbps Fi Min Qty: 2500 Package Multiple: 1 | 0 |
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$7.2000 / $7.7568 | Buy Now |
DISTI #
2514345RL
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Farnell | BYPASS IC, FIBRE CHANNEL PORT, TQFP-32 RoHS: Compliant Min Qty: 2500 Lead time: 11 Weeks, 1 Days Container: Reel | 0 |
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$7.9248 | Buy Now |
DISTI #
2514345
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Farnell | BYPASS IC, FIBRE CHANNEL PORT, TQFP-32 RoHS: Compliant Min Qty: 2500 Lead time: 11 Weeks, 1 Days Container: Cut Tape | 0 |
|
$7.9248 | Buy Now |
Part Details for MAX3750CEE+T
MAX3750CEE+T CAD Models
MAX3750CEE+T Part Data Attributes:
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MAX3750CEE+T
Analog Devices Inc
Buy Now
Datasheet
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MAX3750CEE+T
Analog Devices Inc
+3.3V, 2.125Gbps/1.0625Gbps Fibre-Channel Port Bypass ICs, 16-QSOP-150_MIL, 16 Pins, 0 to 70C
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Part Package Code | 16-QSOP-150_MIL | |
Pin Count | 16 | |
Manufacturer Package Code | 16-QSOP-150_MIL | |
Date Of Intro | 1998-10-23 | |
Samacsys Manufacturer | Analog Devices | |
JESD-30 Code | R-PDSO-G16 | |
JESD-609 Code | e3 | |
Length | 4.9 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 16 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | HSSOP | |
Package Equivalence Code | SSOP16,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.75 mm | |
Supply Current-Max | 0.084 mA | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | BIPOLAR | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.635 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 3.9 mm |