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Overview of MAX3765CUB by Rochester Electronics LLC
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for MAX3765CUB by Rochester Electronics LLC
Part Data Attributes for MAX3765CUB by Rochester Electronics LLC
|
|
---|---|
Pbfree Code
|
No
|
Rohs Code
|
No
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code
|
TSSOP
|
Package Description
|
EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10
|
Pin Count
|
10
|
Reach Compliance Code
|
unknown
|
JESD-30 Code
|
S-PDSO-G10
|
JESD-609 Code
|
e0
|
Length
|
3 mm
|
Moisture Sensitivity Level
|
1
|
Number of Functions
|
1
|
Number of Terminals
|
10
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
HTSSOP
|
Package Shape
|
SQUARE
|
Package Style
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel)
|
245
|
Qualification Status
|
COMMERCIAL
|
Seated Height-Max
|
1.1 mm
|
Supply Voltage-Nom
|
3.3 V
|
Surface Mount
|
YES
|
Telecom IC Type
|
TELECOM CIRCUIT
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
0.5 mm
|
Terminal Position
|
DUAL
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Width
|
3 mm
|
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