Datasheets
MAX40004ANS02+T by:

nanoPower 4-Bump Comparator in Ultra-Tiny 0.73mm x 0.73mm WLP/SOT23 Packages, 4-WLCSP-N/A, 4 Pins, -40 to 125C

Part Details for MAX40004ANS02+T by Analog Devices Inc

Overview of MAX40004ANS02+T by Analog Devices Inc

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Price & Stock for MAX40004ANS02+T

Part # Distributor Description Stock Price Buy
DISTI # 700-MAX40004ANS02+T
Mouser Electronics Analog Comparators 600nA Comparator in Ultra-Tiny 0.76 x 0.76mm Package RoHS: Compliant 0
  • 2,500 $0.6780
  • 5,000 $0.6440
  • 10,000 $0.6200
$0.6200 / $0.6780 Order Now
Analog Devices Inc 600nA Comparator in Ultra-Tiny Min Qty: 2500 Package Multiple: 1 57500
  • 1,000 $0.5500
  • 2,500 $0.6787
  • 5,000 $0.6448
$0.5500 / $0.6787 Buy Now
DISTI # 3582024
Farnell COMPARATOR, -40 TO 125DEG C RoHS: Compliant Min Qty: 2500 Lead time: 11 Weeks, 1 Days Container: Reel 0
  • 2,500 $0.6715
$0.6715 Buy Now

Part Details for MAX40004ANS02+T

MAX40004ANS02+T CAD Models

MAX40004ANS02+T Part Data Attributes:

MAX40004ANS02+T Analog Devices Inc
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MAX40004ANS02+T Analog Devices Inc nanoPower 4-Bump Comparator in Ultra-Tiny 0.73mm x 0.73mm WLP/SOT23 Packages, 4-WLCSP-N/A, 4 Pins, -40 to 125C
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ANALOG DEVICES INC
Part Package Code 4-WLCSP-N/A
Pin Count 4
Manufacturer Package Code 4-WLCSP-N/A
Reach Compliance Code compliant
Date Of Intro 2017-04-07
Samacsys Manufacturer Analog Devices
Amplifier Type COMPARATOR
Average Bias Current-Max (IIB) 0.09 µA
Bias Current-Max (IIB) @25C 0.09 µA
Input Offset Voltage-Max 32000 µV
JESD-30 Code S-PBGA-B4
JESD-609 Code e2
Length 0.728 mm
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 4
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Output Type PUSH-PULL
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA4,2X2,14
Package Shape SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260
Response Time-Nom 25000 ns
Seated Height-Max 0.5 mm
Supply Current-Max 0.0013 mA
Supply Voltage Limit-Max 6 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology BICMOS
Terminal Finish Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
Terminal Form BALL
Terminal Pitch 0.35 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 0.728 mm

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