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Part Details for MAX6612MXK+ by Analog Devices Inc
Overview of MAX6612MXK+ by Analog Devices Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Renewable Energy
Automotive
Price & Stock for MAX6612MXK+
| Part # | Distributor | Description | Stock | Price | Buy | |
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Analog Devices Inc | High-Slope, Low-Power, Analog Min Qty: 1 Package Multiple: 1 | 1629 |
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Part Details for MAX6612MXK+
MAX6612MXK+ CAD Models
MAX6612MXK+ Part Data Attributes:
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MAX6612MXK+
Analog Devices Inc
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Datasheet
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MAX6612MXK+
Analog Devices Inc
High-Slope, Low-Power, Analog Temperature Sensor in an SC70 Package, 5-SC70-N/A, 5 Pins
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Part Package Code | 5-SC70-N/A | |
| Pin Count | 5 | |
| Manufacturer Package Code | 5-SC70-N/A | |
| Date Of Intro | 2002-09-03 | |
| Samacsys Manufacturer | Analog Devices | |
| Analog IC - Other Type | ANALOG CIRCUIT | |
| JESD-30 Code | R-PDSO-G5 | |
| JESD-609 Code | e3 | |
| Length | 2 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 5 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.1 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 2.4 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | BICMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 1.25 mm |