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Artificial Intelligence Microcontroller with Ultra-Low-Power Convolutional Neural Network Accelerator, 81-CSP_BGA-8X8X1.17, 81 Pins, -40 to 85C
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
700-MAX78000EXG+
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Mouser Electronics | ARM Microcontrollers - MCU ARM M4F w/ 432KB Weight CNN Accelerator, RoHS: Compliant | 667 |
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$12.8700 / $14.1500 | Buy Now |
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Analog Devices Inc | ARM M4F w/ 432KB Weight CNN Ac Package Multiple: 1 | 191 |
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$10.6000 / $16.5700 | Buy Now |
DISTI #
71212532
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Verical | MCU 32-bit ARM Cortex M4 RISC 512KB Flash 1.8V/3V 81-Pin CTBGA Tray RoHS: Compliant Min Qty: 348 Package Multiple: 348 Date Code: 2021 | Americas - 348 |
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$10.2670 / $10.7960 | Buy Now |
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MAX78000EXG+
Analog Devices Inc
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MAX78000EXG+
Analog Devices Inc
Artificial Intelligence Microcontroller with Ultra-Low-Power Convolutional Neural Network Accelerator, 81-CSP_BGA-8X8X1.17, 81 Pins, -40 to 85C
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ANALOG DEVICES INC | |
Part Package Code | 81-CSP_BGA-8X8X1.17 | |
Package Description | CTBGA-81 | |
Pin Count | 81 | |
Manufacturer Package Code | 81-CSP_BGA-8X8X1.17 | |
Reach Compliance Code | compliant | |
Date Of Intro | 2020-08-19 | |
Samacsys Manufacturer | Analog Devices | |
JESD-30 Code | S-PBGA-B81 | |
JESD-609 Code | e1 | |
Length | 8 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 81 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA81,9X9,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.3 mm | |
Supply Voltage-Max | 1.21 V | |
Supply Voltage-Min | 0.9 V | |
Supply Voltage-Nom | 1.1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 8 mm | |
uPs/uCs/Peripheral ICs Type | SoC |