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MAX78000EXG+ by:

Artificial Intelligence Microcontroller with Ultra-Low-Power Convolutional Neural Network Accelerator, 81-CSP_BGA-8X8X1.17, 81 Pins, -40 to 85C

Part Details for MAX78000EXG+ by Analog Devices Inc

Overview of MAX78000EXG+ by Analog Devices Inc

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Applications Security and Surveillance Internet of Things (IoT) Space Technology Financial Technology (Fintech) Aerospace and Defense Smart Cities Transportation and Logistics Agriculture Technology Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Automotive Robotics and Drones

Price & Stock for MAX78000EXG+

Part # Distributor Description Stock Price Buy
DISTI # 700-MAX78000EXG+
Mouser Electronics ARM Microcontrollers - MCU ARM M4F w/ 432KB Weight CNN Accelerator, RoHS: Compliant 667
  • 1 $14.1500
  • 10 $12.8800
  • 348 $12.8700
$12.8700 / $14.1500 Buy Now
Analog Devices Inc ARM M4F w/ 432KB Weight CNN Ac Package Multiple: 1 191
  • 1 $16.5700
  • 10 $12.8750
  • 1,000 $10.6000
$10.6000 / $16.5700 Buy Now
DISTI # 71212532
Verical MCU 32-bit ARM Cortex M4 RISC 512KB Flash 1.8V/3V 81-Pin CTBGA Tray RoHS: Compliant Min Qty: 348 Package Multiple: 348 Date Code: 2021 Americas - 348
  • 348 $10.7960
  • 696 $10.6880
  • 1,044 $10.5810
  • 1,740 $10.4750
  • 2,088 $10.3700
  • 2,784 $10.2670
$10.2670 / $10.7960 Buy Now

Part Details for MAX78000EXG+

MAX78000EXG+ CAD Models

MAX78000EXG+ Part Data Attributes

MAX78000EXG+ Analog Devices Inc
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MAX78000EXG+ Analog Devices Inc Artificial Intelligence Microcontroller with Ultra-Low-Power Convolutional Neural Network Accelerator, 81-CSP_BGA-8X8X1.17, 81 Pins, -40 to 85C
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ANALOG DEVICES INC
Part Package Code 81-CSP_BGA-8X8X1.17
Package Description CTBGA-81
Pin Count 81
Manufacturer Package Code 81-CSP_BGA-8X8X1.17
Reach Compliance Code compliant
Date Of Intro 2020-08-19
Samacsys Manufacturer Analog Devices
JESD-30 Code S-PBGA-B81
JESD-609 Code e1
Length 8 mm
Moisture Sensitivity Level 3
Number of Terminals 81
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA81,9X9,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.3 mm
Supply Voltage-Max 1.21 V
Supply Voltage-Min 0.9 V
Supply Voltage-Nom 1.1 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 8 mm
uPs/uCs/Peripheral ICs Type SoC

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