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Part Details for MAX9634WERS+ by Analog Devices Inc
Overview of MAX9634WERS+ by Analog Devices Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MAX9634WERS+
| Part # | Distributor | Description | Stock | Price | Buy | |
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Analog Devices Inc | 1µA, 4-Bump UCSP/SOT23, Precis Min Qty: 1 Package Multiple: 1 | 0 |
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Part Details for MAX9634WERS+
MAX9634WERS+ CAD Models
MAX9634WERS+ Part Data Attributes:
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MAX9634WERS+
Analog Devices Inc
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Datasheet
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MAX9634WERS+
Analog Devices Inc
nanoPower, 4-Bump UCSP/SOT23, Precision Current-Sense Amplifier, 4-WLCSP-N/A, 4 Pins, -40 to 85C
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Part Package Code | 4-WLCSP-N/A | |
| Pin Count | 4 | |
| Manufacturer Package Code | 4-WLCSP-N/A | |
| Date Of Intro | 2009-11-12 | |
| Samacsys Manufacturer | Analog Devices | |
| Amplifier Type | OPERATIONAL AMPLIFIER | |
| Architecture | VOLTAGE-FEEDBACK | |
| Common-mode Reject Ratio-Min | 94 dB | |
| Common-mode Reject Ratio-Nom | 130 dB | |
| Frequency Compensation | YES | |
| Input Offset Voltage-Max | 425 µV | |
| JESD-30 Code | S-PBGA-B4 | |
| JESD-609 Code | e1 | |
| Length | 1 mm | |
| Low-Offset | YES | |
| Micropower | YES | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 4 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA4,2X2,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Power | NO | |
| Programmable Power | NO | |
| Seated Height-Max | 0.69 mm | |
| Supply Current-Max | 0.0025 mA | |
| Supply Voltage Limit-Max | 30 V | |
| Supply Voltage-Nom (Vsup) | 3.6 V | |
| Surface Mount | YES | |
| Technology | BICMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Unity Gain BW-Nom | 21.15 | |
| Wideband | NO | |
| Width | 1 mm |