There are no models available for this part yet.
Overview of MB89R112A2-DIAP15-JN by FUJITSU Limited
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Renewable Energy
Robotics and Drones
CAD Models for MB89R112A2-DIAP15-JN by FUJITSU Limited
Part Data Attributes for MB89R112A2-DIAP15-JN by FUJITSU Limited
|
|
|
|---|---|
|
Part Life Cycle Code
|
Contact Manufacturer
|
|
Ihs Manufacturer
|
FUJITSU LTD
|
|
Package Description
|
DIE,
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.71
|
|
Additional Feature
|
DATA RETENTION TIME @ 85 DEGREE CENTIGRADE
|
|
Data Retention Time-Min
|
10
|
|
Endurance
|
1000000000000 Write/Erase Cycles
|
|
JESD-30 Code
|
X-XUUC-N
|
|
JESD-609 Code
|
e4
|
|
Memory Density
|
73728 bit
|
|
Memory IC Type
|
FRAM-EMBEDDED
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Words
|
9216 words
|
|
Number of Words Code
|
9000
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-20 °C
|
|
Organization
|
9KX8
|
|
Package Body Material
|
UNSPECIFIED
|
|
Package Code
|
DIE
|
|
Package Equivalence Code
|
DIE OR CHIP
|
|
Package Shape
|
UNSPECIFIED
|
|
Package Style
|
UNCASED CHIP
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Terminal Finish
|
GOLD
|
|
Terminal Form
|
NO LEAD
|
|
Terminal Position
|
UPPER
|