Part Details for MB89R112A2-DIAP15-JNP1 by FUJITSU Limited
Overview of MB89R112A2-DIAP15-JNP1 by FUJITSU Limited
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for MB89R112A2-DIAP15-JNP1
MB89R112A2-DIAP15-JNP1 CAD Models
MB89R112A2-DIAP15-JNP1 Part Data Attributes
|
MB89R112A2-DIAP15-JNP1
FUJITSU Limited
Buy Now
Datasheet
|
Compare Parts:
MB89R112A2-DIAP15-JNP1
FUJITSU Limited
Memory Circuit, 9KX8, CMOS, WAFER
|
Part Life Cycle Code | Contact Manufacturer | |
Ihs Manufacturer | FUJITSU LTD | |
Package Description | DIE, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Additional Feature | DATA RETENTION TIME @ 85 DEGREE CENTIGRADE | |
Data Retention Time-Min | 10 | |
Endurance | 1000000000000 Write/Erase Cycles | |
JESD-30 Code | X-XUUC-N | |
JESD-609 Code | e4 | |
Memory Density | 73728 bit | |
Memory IC Type | FRAM-EMBEDDED | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Words | 9216 words | |
Number of Words Code | 9000 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -20 °C | |
Organization | 9KX8 | |
Package Body Material | UNSPECIFIED | |
Package Code | DIE | |
Package Equivalence Code | DIE OR CHIP | |
Package Shape | UNSPECIFIED | |
Package Style | UNCASED CHIP | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | GOLD | |
Terminal Form | NO LEAD | |
Terminal Position | UPPER |