There are no models available for this part yet.
Overview of MB89R118C2-DIAP15 by FUJITSU Limited
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
CAD Models for MB89R118C2-DIAP15 by FUJITSU Limited
Part Data Attributes for MB89R118C2-DIAP15 by FUJITSU Limited
|
|
|
|---|---|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
FUJITSU LTD
|
|
Package Description
|
WAFER
|
|
Reach Compliance Code
|
compliant
|
|
HTS Code
|
8542.39.00.01
|
|
Additional Feature
|
DATA RETENTION TIME @ 85 DEGREE CENTIGRADE
|
|
Data Retention Time-Min
|
10
|
|
Endurance
|
1000000000000 Write/Erase Cycles
|
|
JESD-30 Code
|
X-XUUC-N
|
|
Memory Density
|
16384 bit
|
|
Memory IC Type
|
FRAM-EMBEDDED
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Words
|
2048 words
|
|
Number of Words Code
|
2000
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-20 °C
|
|
Organization
|
2KX8
|
|
Package Body Material
|
UNSPECIFIED
|
|
Package Code
|
DIE
|
|
Package Equivalence Code
|
DIE OR CHIP
|
|
Package Shape
|
UNSPECIFIED
|
|
Package Style
|
UNCASED CHIP
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Terminal Form
|
NO LEAD
|
|
Terminal Position
|
UPPER
|