Datasheets
MBRB20100CT by:

Rectifier Diode, Schottky, 1 Phase, 2 Element, 10A, 100V V(RRM), Silicon, TO-263AB, TO-263, 3/2 PIN

Part Details for MBRB20100CT by Yangzhou Yangjie Electronics Co Ltd

Results Overview of MBRB20100CT by Yangzhou Yangjie Electronics Co Ltd

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MBRB20100CT Information

MBRB20100CT by Yangzhou Yangjie Electronics Co Ltd is a Rectifier Diode.
Rectifier Diodes are under the broader part category of Diodes.

A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.

Part Details for MBRB20100CT

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MBRB20100CT Part Data Attributes

MBRB20100CT Yangzhou Yangjie Electronics Co Ltd
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MBRB20100CT Yangzhou Yangjie Electronics Co Ltd Rectifier Diode, Schottky, 1 Phase, 2 Element, 10A, 100V V(RRM), Silicon, TO-263AB, TO-263, 3/2 PIN
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer YANGZHOU YANGJIE ELECTRONICS CO LTD
Package Description TO-263, 3/2 PIN
Reach Compliance Code unknown
Additional Feature FREE WHEELING DIODE, TUBE: 50
Application GENERAL PURPOSE
Case Connection CATHODE
Configuration COMMON CATHODE, 2 ELEMENTS
Diode Element Material SILICON
Diode Type RECTIFIER DIODE
Forward Voltage-Max (VF) 0.8 V
JEDEC-95 Code TO-263AB
JESD-30 Code R-PSSO-G2
JESD-609 Code e3
Moisture Sensitivity Level 1
Non-rep Pk Forward Current-Max 150 A
Number of Elements 2
Number of Phases 1
Number of Terminals 2
Operating Temperature-Max 175 °C
Operating Temperature-Min -55 °C
Output Current-Max 10 A
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Rep Pk Reverse Voltage-Max 100 V
Reverse Current-Max 100 µA
Reverse Test Voltage 100 V
Surface Mount YES
Technology SCHOTTKY
Terminal Finish Tin (Sn)
Terminal Form GULL WING
Terminal Position SINGLE

MBRB20100CT Related Parts

MBRB20100CT Frequently Asked Questions (FAQ)

  • The recommended PCB layout involves placing the device on a multi-layer board with a solid ground plane, using thermal vias to dissipate heat, and keeping the input and output traces separate to minimize noise. A heat sink or thermal pad can be added to improve thermal management.

  • To ensure proper biasing, follow the recommended voltage and current ratings, and use a stable voltage source. The device should be biased in the linear region, and the input voltage should be within the specified range. A voltage regulator or filter can be used to reduce noise and ensure a stable input voltage.

  • To prevent damage, follow standard SMT soldering procedures, using a soldering iron with a temperature range of 250-260°C. Avoid applying excessive force or pressure, and handle the device by the edges to prevent electrostatic discharge (ESD). Use an ESD wrist strap or mat if necessary.

  • To troubleshoot common issues, check the PCB layout and thermal management, ensure proper biasing and input voltage, and verify that the device is operated within the specified frequency range. Use oscilloscopes or spectrum analyzers to measure output waveforms and identify noise or oscillation sources.

  • Yes, to minimize EMI/EMC issues, use a shielded enclosure, keep the device away from other noise sources, and use filtering or shielding on the input and output lines. Follow standard EMI/EMC design practices, such as using a common mode choke or ferrite beads, and ensure the device is operated within the specified frequency range.

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