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Part Details for MC33FS6502LAE by NXP Semiconductors
Overview of MC33FS6502LAE by NXP Semiconductors
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- Number of FFF Equivalents:
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- Number of Functional Equivalents:
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Price & Stock for MC33FS6502LAE
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
568-13811-ND
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DigiKey | SYSTEM BASIS CHIP DCDC 0.8A VCO Min Qty: 1 Lead time: 20 Weeks Container: Tray |
249 In Stock |
|
$5.7969 / $10.2200 | Buy Now |
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DISTI #
MC33FS6502LAE
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Avnet Americas | System Basis Chip, CAN FD, LIN, 2.7 V to 40 V, 48 Pins, LQFP-EP - Trays (Alt: MC33FS6502LAE) RoHS: Compliant Min Qty: 750 Package Multiple: 250 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
|
RFQ | |
|
DISTI #
841-MC33FS6502LAE
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Mouser Electronics | Power Management Specialized - PMIC System Basis Chip, DCDC 0.8A Vcore LDT CAN LIN, LQFP48EP RoHS: Compliant | 2489 |
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$5.8000 / $9.8700 | Buy Now |
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Future Electronics | 40 V Safety Power System Basis Chip w/CAN FD and LIN Transceiver - LQFP-48EP RoHS: Compliant pbFree: Yes Min Qty: 1000 Package Multiple: 250 Container: Tray | 0Tray |
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$6.5200 | Buy Now |
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Rochester Electronics | Safety Power System Basis Chip With CAN Fd And LIN Transceivers RoHS: Compliant Status: Active Min Qty: 1 | 1000 |
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$5.8000 / $6.8200 | Buy Now |
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DISTI #
MC33FS6502LAE
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Avnet Americas | System Basis Chip, CAN FD, LIN, 2.7 V to 40 V, 48 Pins, LQFP-EP - Trays (Alt: MC33FS6502LAE) RoHS: Compliant Min Qty: 750 Package Multiple: 250 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
|
RFQ | |
|
DISTI #
MC33FS6502LAE
|
Avnet Americas | System Basis Chip, CAN FD, LIN, 2.7 V to 40 V, 48 Pins, LQFP-EP - Trays (Alt: MC33FS6502LAE) RoHS: Compliant Min Qty: 750 Package Multiple: 250 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
|
RFQ | |
|
DISTI #
MC33FS6502LAE
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Avnet Silica | System Basis Chip, CAN FD, LIN, 2.7 V to 40 V, 48 Pins, LQFP-EP (Alt: MC33FS6502LAE) RoHS: Compliant Min Qty: 250 Package Multiple: 250 Lead time: 2 Weeks, 4 Days | Silica - 0 |
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Buy Now | |
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DISTI #
MC33FS6502LAE
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EBV Elektronik | System Basis Chip, CAN FD, LIN, 2.7 V to 40 V, 48 Pins, LQFP-EP (Alt: MC33FS6502LAE) RoHS: Compliant Min Qty: 250 Package Multiple: 250 Lead time: 2 Weeks, 4 Days | EBV - 0 |
|
Buy Now |
Part Details for MC33FS6502LAE
MC33FS6502LAE CAD Models
MC33FS6502LAE Part Data Attributes
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MC33FS6502LAE
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MC33FS6502LAE
NXP Semiconductors
Interface Circuit
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | S-PQFP-G48 | |
| Length | 7 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Transceivers | 1 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HLFQFP | |
| Package Equivalence Code | QFP48,.35SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | SMARTMOS | |
| Telecom IC Type | CAN FD/LIN TRANSCEIVER | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 7 mm |